Package stack structure

Abstract

A package stack structure is provided, including a first substrate, a second substrate stacked on the first substrate, and an encapsulant formed between the first substrate and the second substrate. Athrough hole is formed to penetrate the second substrate and allow the encapsulant to be filled therein, thereby increasing the contact area and hence strengthening the bonding between the encapsulant and the second substrate.

Description

technical field [0001] The present invention relates to a package structure, in particular to a package stack structure. Background technique [0002] With the evolution of semiconductor packaging technology, different packaging types have been developed for semiconductor devices. In order to improve electrical functions and save packaging space, stacking multiple packaging structures has been developed to form a package stack structure (Package on Package, referred to as POP) technology, this packaging method can play the heterogeneous integration characteristics of the system package (SiP), and can integrate electronic components with different functions, such as: memory, central processing unit, graphics processor, image application processor, etc. , through stacking design to achieve system integration, suitable for various thin and light electronic products. [0003] figure 1 It is a schematic cross-sectional view of an existing packaging stack structure 1 . Such as ...

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Problems solved by technology

[0004] However, in the existing packaging stack structure 1, the solder resist layer 123 is provided on both sides of the intermediary substrate 12, and the solder resist layer 123 is prone to whitening after multiple processes, so that the packaging compound 14 and the intermediary substrate 12 Easy to delamination (delamination)

[0005] In addition, when forming the encapsulant 14 , air tends to remain between the encapsulation substrate 11 and the interposer substrate 12 , so voids are likely to be generated in the encapsulant 14 , resulting in reduced yield.

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