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A kind of low dielectric and low dielectric loss glass fiber copper clad laminate and preparation method thereof

A low-dielectric, copper-clad laminate technology, applied in the direction of chemical instruments and methods, electronic equipment, and other household appliances, can solve the problems of low dielectric, high content of polar groups, unfavorable dielectric and dielectric loss reduction, etc.

Active Publication Date: 2020-06-30
SICHUAN DONGFANG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the disadvantages of high polar group content after resin curing in the production of glass fiber copper clad laminates in the prior art, which is not conducive to the reduction of dielectric and dielectric loss, and to provide a low dielectric and low dielectric loss glass fiber Copper clad laminate and its preparation method

Method used

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  • A kind of low dielectric and low dielectric loss glass fiber copper clad laminate and preparation method thereof
  • A kind of low dielectric and low dielectric loss glass fiber copper clad laminate and preparation method thereof
  • A kind of low dielectric and low dielectric loss glass fiber copper clad laminate and preparation method thereof

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preparation example Construction

[0047] Part 1 Preparation of Low Dielectric and Low Dielectric Loss Adhesives

[0048] 1. Basic process:

[0049] 10 parts by mass of epoxy resin, 35-40 parts by mass of phosphorus-containing phenolic resin, 12-18 parts by mass of unsaturated polyesterimide resin, 30-32 parts by mass of unsaturated benzoxazine resin, 3-6 parts by mass of phosphoric acid ester parts, 1 to 2 parts by mass of initiator, 10 to 12 parts by mass of curing agent, 10 to 15 parts by mass of diluent and 25 to 35 parts by mass of solvent, mixed uniformly at room temperature, and then Add 25 to 35 parts by mass of inorganic powder, stir evenly, and set aside.

[0050] 2. Raw materials used:

[0051] The epoxy resin used is bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin.

[0052] The general chemical structure formula of described phosphorus-containing phenolic resin is as follows:

[0053] Where: X 1～6 = or H, but not H at the same time; m=0~2.

[0054] The struc...

Embodiment 9

[0084] A low dielectric and low dielectric loss glass fiber copper clad laminate, which is composed of alkali-free glass fiber cloth, inorganic powder, resin cured product and its copper foil, characterized in that: the resin cured product is a combination of flame retardant unsaturated resin The heat-cured product of the product, the mass ratio of the heat-cured product of the alkali-free glass fiber cloth, inorganic powder and flame-retardant unsaturated resin composition contained in the low dielectric and low dielectric loss glass fiber copper-clad laminate is: 57 parts by mass of alkali-free glass fiber cloth, 5 parts by mass of inorganic powder, 33 parts by mass of thermosetting material of flame-retardant unsaturated resin composition;

[0085] The flame retardant unsaturated resin composition consists of 10 parts by mass of epoxy resin, 35 parts by mass of phosphorus-containing phenolic resin, 12 parts by mass of unsaturated polyesterimide resin, 30 parts by mass of uns...

Embodiment 10

[0087] A low dielectric and low dielectric loss glass fiber copper clad laminate, which is composed of alkali-free glass fiber cloth, inorganic powder, resin cured product and its copper foil, characterized in that: the resin cured product is a combination of flame retardant unsaturated resin The heat-cured product of the product, the mass ratio of the heat-cured product of the alkali-free glass fiber cloth, inorganic powder and flame-retardant unsaturated resin composition contained in the low dielectric and low dielectric loss glass fiber copper-clad laminate is: 62 parts by mass of alkali-free glass fiber cloth, 7 parts by mass of inorganic powder, 37 parts by mass of thermosetting material of flame-retardant unsaturated resin composition;

[0088] The flame retardant unsaturated resin composition consists of 10 parts by mass of epoxy resin, 40 parts by mass of phosphorus-containing phenolic resin, 18 parts by mass of unsaturated polyesterimide resin, 32 parts by mass of uns...

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Abstract

The invention discloses a glass fiber copper-clad plate with low dielectric constant and low dielectric loss and a preparation method of the glass fiber copper-clad plate. The plate is prepared from alkali-free glass fiber cloth, inorganic powder, a thermos-cured substance of flame-retardant unsaturated resin composition as well as copper foil. The preparation method comprises the following steps:adding the inorganic powder to the flame-retardant unsaturated resin composition containing epoxy resin, phosphorus-containing phenolic resin, unsaturated polyester imide resin, unsaturated benzoxazine resin, phosphate, an initiator, a curing agent, a diluent and a solvent, uniformly stirring the mixture to prepare an adhesive with low dielectric constant and low dielectric loss; soaking the alkali-free glass fiber cloth in the adhesive with low dielectric constant and low dielectric loss, feeding the cloth to a gluing machine drying channel for pre-drying to prepare glass fiber prepreg withlow dielectric constant and low dielectric loss; performing cutting, mixing and overlapping the prepreg with low dielectric constant and low dielectric loss and the copper foil according to required thickness of a product, and feeding the product into a hot press for hot-press forming to obtain the glass fiber copper-clad plate with low dielectric constant and low dielectric loss. The glass fibercopper-clad plate is applicable to various manufacture fields such as motors, electric appliances, home appliances, computers and the like and has good performance.

Description

technical field [0001] The invention belongs to electrical insulation glass fiber copper clad plate and its preparation, and relates to a low dielectric and low dielectric loss glass fiber copper clad plate and a preparation method thereof. The low dielectric (dielectric is the dielectric constant, the same below) and low dielectric loss (dielectric loss is the dielectric loss, the same below) glass fiber copper clad laminate of the present invention is suitable for use as the basis of many manufacturing fields such as motors, electrical appliances, home appliances and computers. Composite materials have a wide range of applications. Background technique [0002] Glass fiber copper clad laminate is one of the basic insulating plates for low-voltage electrical appliances and the electronics industry. It is mainly used for processing and manufacturing printed circuit boards (referred to as PCBs), and is the main component of electronic and electrical products such as computers...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B17/12B32B15/20B32B15/04B32B15/14B32B37/12B32B37/06B32B37/10B32B38/16C08F291/12C08F291/10C08F291/08C08K5/521
CPCB32B5/02B32B5/26B32B15/043B32B15/14B32B15/20B32B37/06B32B37/10B32B37/1284B32B38/164B32B2260/021B32B2260/023B32B2260/046B32B2262/101B32B2307/3065B32B2311/12B32B2457/08C08F283/00C08F283/10C08K5/521
Inventor 赵恩顺叶伦学杨波黄杰唐安斌
Owner SICHUAN DONGFANG INSULATING MATERIAL