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OLED package structure, OLED device, display device and preparation method of OLED package structure

A packaging structure and device technology, which is applied in the field of OLED devices, can solve problems such as device damage and increased complexity of the preparation process, and achieve the effects of protection from damage, simple preparation methods, and easy implementation

Active Publication Date: 2018-05-29
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, functional materials often cause damage to the device, so the existing OLED packaging structure is usually completed by two coating and curing processes
Although this existing process reduces the damage to the device to a certain extent, the complexity of the preparation process is greatly increased

Method used

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  • OLED package structure, OLED device, display device and preparation method of OLED package structure
  • OLED package structure, OLED device, display device and preparation method of OLED package structure

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Embodiment Construction

[0047] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and that the description and drawings therein are illustrative in nature and not intended to limit the present invention. invention.

[0048] In the following description of various exemplary embodiments of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of example different exemplary structures, systems, and embodiments in which aspects of the invention may be implemented and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope...

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Abstract

The invention discloses an OLED package structure comprising a substrate, a cover plate and a first sealant layer. A sealed space is defined by the substrate, the cover plate and the first sealant layer together. A functional sealant layer is formed by filling the sealed space with a functional sealant. A second sealant layer is formed by setting a second sealant between the substrate and the functional sealant layer. The density of the second sealant is smaller than the density of the functional sealant. The physical characteristic that fluid stratification is caused by a density difference is used, a filling structure of double functional layer of the second sealant layer and the functional sealant layer is constructed between the cover plate and the substrate through gravity deposition,an OLED device is effectively protected from being damaged, and a preparation method is simple and easy to implement.

Description

technical field [0001] The invention relates to the technical field of OLED devices, in particular to an OLED packaging structure, an OLED device, a display device and a method for preparing the OLED packaging structure. Background technique [0002] Organic light-emitting diodes (organic light-emitting diode, OLED), as a new display technology, has attracted more and more attention from related industries. During the preparation and use of OLED devices, such as OLED packaging structures, the intrusion of water and oxygen seriously affects the performance and life of the device. How to better package has become an important research topic to be solved in this field. In the preparation process of the existing OLED encapsulation structure, in order to enhance the encapsulation effect, functional materials are usually used for filling. The functional properties of the so-called functional materials mainly include water absorption, conductivity, and the like. However, functiona...

Claims

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Application Information

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IPC IPC(8): H01L51/52
CPCH10K59/873H10K59/874H10K59/8794H10K59/8722H10K50/8426H10K59/00H10K71/00H10K50/87H10K50/844H10K50/846
Inventor 于东慧侯文军
Owner BOE TECH GRP CO LTD
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