Electronic component screening method and device, manufacturing device for braiding electronic component series
A technology of electronic components and screening methods, applied in the field of manufacturing devices, can solve the problems of magnetization of electronic components and the like
Active Publication Date: 2020-08-14
MURATA MFG CO LTD
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- Abstract
- Description
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- Application Information
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Problems solved by technology
In this case, since the current flows between the electrodes, the electronic components may be magnetized
Method used
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[0048] One embodiment will be described below.
[0049] It should be noted that, in the drawings, constituent elements may be enlarged for easy understanding. The dimensional ratios of components may differ from actual dimensional ratios or dimensional ratios in other drawings. In addition, in cross-sectional views, hatching of some constituent elements may be omitted for easy understanding.
[0050] like figure 2 As shown, the manufacturing device 10 for braiding electronic component tandem has a conveying device 11 , a braiding device 12 , a demagnetizing device 13 , and a control device 14 . The control device 14 drives and controls the conveying device 11 , the braiding device 12 and the demagnetizing device 13 . In addition, in figure 2 In the figure, one control device 14 is shown, but it is also possible to provide a control device for each device.
[0051] The conveyance device 11 has three reel parts 21 , 22 , and 23 . The reel unit 21 supplies a carrier tape ...
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Abstract
The invention relates to a method for sorting electronic parts, an apparatus for sorting the electronic parts, and a manufacturing apparatus for taping an electronic part series, through which the screening considering demagnetization can be performed. Measuring terminals (T1, T2) with applied bias voltages are in contact with external electrodes (42, 43) of an electronic par (40) to clean contactportions, in contact with the measuring terminals, of the external electrodes and measure an impedance value of the electronic part through the measuring terminals. An upper limit screening thresholdand a lower limit screening threshold corresponding to the electronic part and the measured impedance value are compared to determine the quality of the electronic part and screen qualified electronic parts. The upper limit screening threshold and the lower limit screening threshold are set based on a factory upper limit threshold and a factory lower limit threshold for delivery of the electronicparts and a demagnetization change rate of the impedance change in demagnetization of the electronic parts through following formulas: the upper limit screening threshold=the factory upper limit threshold*(1+the demagnetization change rate), and the lower limit screening threshold=the factory lower limit threshold*(1+the demagnetization change rate).
Description
technical field [0001] The present invention relates to a screening method for electronic components, a screening device for electronic components, and a manufacturing device for taping electronic component strings. Background technique [0002] Electrolytic plating has conventionally been performed on electrodes of electronic components such as chip inductors. Since a current flows between the electrodes when the electrodes are electrolytically plated, electronic components may be magnetized. Magnetism in an electronic component can affect the electrical properties of the electronic component. Therefore, various methods of demagnetizing the electronic component by passing the electronic component through an annular solenoid have been proposed (for example, refer to Patent Documents 1 and 2). [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 4-239105 [0004] Patent Document 2: Japanese Patent Application Laid-Open No. 8-67329 [0005] In an electroni...
Claims
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IPC IPC(8): B07C5/344B07C5/02H01F17/00H01F27/28
CPCB07C5/02B07C5/344H01F17/0013H01F27/2804H01F2027/2809G01R27/02H01F13/006H01F27/28H01F41/00
Inventor 立花薰长田孝则
Owner MURATA MFG CO LTD