A mold for preparing a polishing layer and its preparation method
A polishing layer and mold technology, applied in the polishing field, can solve problems such as increasing man-hours and reducing production efficiency
Active Publication Date: 2019-12-31
HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD
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- Claims
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Problems solved by technology
[0005] The polishing layer produced in the existing production process does not have the above-mentioned classification marks. If it is necessary to add a classification mark, it is necessary to add a classification mark step in the existing production process. Not only does it need to increase the corresponding device, but also increases the man-hours, thereby reducing production efficiency
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[0042] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0043] see Figure 4 and 5 As shown, the first embodiment of the present invention provides a mold for preparing a polishing layer, which includes a lower mold 1 and an annular upper mold 2 arranged on the surface of the lower mold 1, the lower mold 1 is a circular structure, and the annular upper mold 2 and the lower mold 1 together form a cylindrical mold cavity 3, and the mold cavity 3 contains the liquid polymer mixture for preparing the polishing layer.
[0044] The side wall of the annular upper mold 2 is provided with a protruding portion 21 along the axial direction of the mold cavity 3, and the protruding portion 21 has an accommodation cavity 211, and the accommodation cavity 211 runs through the protruding portion 21 and communicates with the mold cavity 3. The cross-section of the housing cavity 211 is perpendicular to t...
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Abstract
The invention discloses a die for preparing polishing layers and a preparing method, and relates to the technical field of polishing. The die comprises a lower die body and an annular upper die body arranged on the surface of the lower die body. The annular upper die body and the lower die body together form a cylindrical die cavity. The die cavity contains a liquid polymerization mixture for preparing the polishing layers. The side wall of the annular upper die body is provided with a protruding part in the axis direction of the die cavity. The protruding part is provided with a containing cavity. The containing cavity penetrates through the protruding part and is communicated with the die cavity. The cross section of the containing cavity is perpendicular to the axis of the die cavity. The section area of the containing cavity is gradually increased in the direction from the center to the two ends of the axis of the die cavity. No additional device or working hours need to be added,and the polishing layers of different densities can be rapidly and easily recognized.
Description
technical field [0001] The invention relates to the technical field of polishing, in particular to a mold for preparing a polishing layer and a preparation method. Background technique [0002] With the development of semiconductor memory (Memory) and logic devices (Logic device), in order to increase the density of electronic components and reduce production costs, there is a tendency to increase the aspect ratio (Aspect ratio) and increase the number of wire layers in the device manufacturing process. Chemical Mechnical Polishing (CMP) has become the most effective process method to finally obtain a nano-scale ultra-smooth and non-damaged surface in silicon wafer processing and interlayer planarization of multilayer wiring, and it is also a practical technology that can achieve local and full local planarization . Polishing pads are an important part of the CMP system and the main consumables of the CMP process. The surface structure and structure of the polishing layer ...
Claims
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IPC IPC(8): B24D18/00B24B37/20
CPCB24B37/20B24D18/0009
Inventor 朱顺全车丽媛张季平吴晓茜
Owner HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD