Quantum dot led device and packaging method thereof, backlight strip and backlight module

A technology of LED devices and packaging methods, applied in the field of LED backlight, to achieve the effects of preventing corrosion, reducing damage, and good heat insulation effect

Active Publication Date: 2019-12-24
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is also to provide a packaging method for quantum dot LED devices, which solves the influence of external heat and the heat generated by the quantum dots on the quantum dots themselves during the excited light process, and improves the reliability of the device.

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  • Quantum dot led device and packaging method thereof, backlight strip and backlight module
  • Quantum dot led device and packaging method thereof, backlight strip and backlight module
  • Quantum dot led device and packaging method thereof, backlight strip and backlight module

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Embodiment Construction

[0065] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below.

[0066] The reported quantum dot materials are all in the form of organic solvent compounding in the process of preparing LEDs. The preparation process has many steps and is not environmentally friendly. Moreover, the quantum dot materials themselves will generate a large amount of heat during the light emission process. If the heat cannot be Quickly evacuated, resulting in heat accumulation, affecting the reliability of LED devices.

[0067] For this reason, the present invention provides a kind of packaging method of quantum dot LED device, and described quantum dot LED device is specifically On-Chip type quantum dot LED device, comprising:

[0068] (1) Pretreatment is performed on the LED chip. The pretreatment includes ion cleaning of the empty support, high-temperature heating, and solid crystal and wire...

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Abstract

The invention discloses a packaging method of a quantum dot LED device. The method comprises that (1) an LED chip is preprocessed; and (2) a light conversion substance and a curing glue are mixed andstirred, coated on the LED chip and solidified to form a light emitting layer. At least one light conversion substance includes quantum dots, the quantum dots are formed by embedding quantum dot particles into a high-molecular polymer, and the high-molecular polymer includes polymer microballoons with meso-structures. The invention also provides the quantum dot LED device prepared by the packagingmethod, a backlight light bar and a backlight module. The quantum dots can be directly mixed with the curing glue needless of an organic solvent, procedures are simplified, the organic solvent is prevented from polluting the environment, influence of external heat and heat generated by the quantum dots themselves in the light emitting process on the quantum dots are avoided, and the reliability of the device is improved.

Description

technical field [0001] The invention relates to the field of LED backlights, in particular to a packaging method for a quantum dot LED device, a quantum dot LED device obtained by the packaging method, and a backlight strip and a backlight module using the quantum dot LED device. Background technique [0002] Quantum dots (abbreviated as QD) have the advantages of continuously controllable emission wavelength, high luminous efficiency and narrow half-wave width, so they have broad application prospects in the field of high color gamut backlight display. Current quantum dot displays are mainly based on Q-LCD and Q-LCF technologies. Q-LCD adopts the form of side-lit backlight, combined with blue LED, assembled into a new white light backlight source. The typical packaging form of Q-LCD is glass tube + quantum dot glue, and the quantum dot glue contains red QD and green QD. Q-LCF is in the form of a membrane, which encapsulates quantum dots into a sandwich structure, in which...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/56H01L33/44
CPCH01L33/005H01L33/44H01L33/48H01L33/504H01L33/56H01L2933/0033H01L2933/0041H01L2933/005
Inventor 陈均华刘发波黄杨程龚丹雷彭伟建陈翔闫钟海陈子豪陈伟能
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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