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Sheet and composite sheet

A chip and front layer technology, applied in the field of wafers and composite wafers, can solve problems such as inability to ensure reliability

Active Publication Date: 2018-06-19
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, power modules using such conductive adhesives may not be able to secure predetermined reliability (e.g., reliability evaluated in a temperature cycle test)

Method used

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  • Sheet and composite sheet
  • Sheet and composite sheet
  • Sheet and composite sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0026] (composite sheet 1)

[0027] Such as figure 1 As shown, the composite sheet 1 is in a roll shape. The composite sheet 1 includes a release liner 13 , sheets 71 a , 71 b , 71 c , . . . , and 71 m arranged on the release liner 13 (hereinafter collectively referred to as “sheet 71 ”). The distance between the piece 71a and the piece 71b, the distance between the piece 71b and the piece 71c, ... the distance between the piece 71l and the piece 71m are fixed.

[0028] Such as figure 2 As shown, sheet 71 comprises pre-sintered layer 11 . The sheet 71 also includes the dicing sheet 12 disposed on the pre-sintering layer 11 . The dicing sheet 12 includes a base material 121 and an adhesive layer 122 disposed on the base material 121 . Both surfaces of the pre-sintering layer 11 are defined by a first main surface in contact with the adhesive layer 122 and a second main surface opposite to the first main surface. The second main surface is in contact with the release lin...

Embodiment

[0074] The present invention will be described in detail below using examples, but the present invention is not limited to the following examples unless the gist is exceeded.

[0075] [Raw materials of pre-sintered sheets, etc.]

[0076] Adjusted ANP-1: The amount of the viscosity-adjusting solvent contained in ANP-1 (a paste in which nano-sized silver particles are dispersed in a binder) manufactured by Applied Nanoparticle Laboratory Corporation was appropriately adjusted.

[0077] Copper fine particles: Copper fine particles with an average particle diameter of 200 nm and a crystallite diameter of 31 nm manufactured by Mitsui Metal Mining Co., Ltd.

[0078] MM-2002-1: MM-2002-1 (acrylic polymer) manufactured by Fujikura Kasei Co., Ltd.

[0079] QPAC40: QPAC40 manufactured by Empower Corporation (polypropylene carbonate with a weight average molecular weight of 50,000 to 350,000)

[0080] Terusolve MTPH: Terusolve MTPH (high viscosity terpene alcohol) manufactured by Nippo...

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Abstract

To provide a sheet having a pre-sintering layer capable of having a thickness after sintering to such a degree that stress can be relaxed.SOLUTION: The present invention relates to a sheet containinga pre-sintering layer. A viscosity of the pre-sintering layer at 90 DEG C is 0.27 MPa s or higher. A thickness of the pre-sintering layer is 30 mum to 200 mum.

Description

technical field [0001] The present invention relates to sheets and composite sheets. Background technique [0002] In some cases, the chip is fixed on the substrate with a conductive adhesive that does not have the property of being a sintered body at a low temperature (for example, 300° C.). However, power modules using such conductive adhesives may not be able to secure predetermined reliability (for example, reliability evaluated in a temperature cycle test). [0003] On the other hand, a bonding agent containing nano-sized metal particles can become a sintered body at low temperature. For example, Patent Document 1 discloses a technique of applying a paste containing silver fine particles having an average primary particle diameter of 1 to 50 nm on a substrate, drying the paste, and firing the paste. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: JP 2015-4105 Contents of the invention [0007] The problem to be solved by the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52B32B9/00C09J1/00C09J7/00C09J7/29C09J7/28C09J7/10C09J7/20C09J7/24C09J7/25
CPCH01L2924/181B32B9/00C08K3/08C08K3/10C09J1/00C09J7/00C09J9/02H01L21/52C09J2203/326H01L2224/27H01L2224/48227H01L2224/73265H01L2224/83191C09J7/20C09J7/10C09J2301/314C09J2301/408H01L2924/00012C09J7/25C09J7/28C09J7/24C08K2003/0806C08K2003/085C08K2003/2248C08K2003/2286C08K2201/001C09J11/04C09J2400/16C09J2433/00C09J2469/00H01L21/6836H01L24/29H01L24/73H01L24/83H01L2221/68327H01L2224/29239H01L2224/29247H01L2224/29286H01L2224/8384H01L2924/10253H01L2924/10272H01L2924/1033
Inventor 镰仓菜穗菅生悠树
Owner NITTO DENKO CORP