Image sensor, electronic device and its manufacturing method

A technology of image sensor and electronic device, applied in the field of electronic device and its manufacturing, image sensor and its manufacturing

Inactive Publication Date: 2018-06-22
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, BSI image sensors may a

Method used

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  • Image sensor, electronic device and its manufacturing method
  • Image sensor, electronic device and its manufacturing method
  • Image sensor, electronic device and its manufacturing method

Examples

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Embodiment Construction

[0021] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.

[0022] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way intended as any limitation of the disclosure, its application or uses.

[0023] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered a part of this description.

[0024] In all examples shown and discussed herein, any specific values ​​should be construed as illustrative only, and not as limiting. Therefore, other examples of the exemplary embodiment...

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Abstract

The present disclosure relates to an image sensor, electronic device and its manufacturing method. In one embodiment, the present disclosure relate to an image sensor which may comprise a substrate, afirst surface and a second surface opposite to the first surface; a pixel sensor array arranged within the substrate; a composite grid arranged over a first surface of the said substrate and having an opening corresponding to a pixel sensor in the pixel sensor array; wherein the said composite grid has a dielectric layer, a hard mask layer arranged over the dielectric layer, and a metal layer surrounding the dielectric layer and the hard mask layer.

Description

technical field [0001] The present disclosure generally relates to the field of semiconductor technology, and more particularly, to an image sensor and a manufacturing method thereof, and an electronic device including the image sensor and a manufacturing method thereof. Background technique [0002] Many modern electronic devices involve electronic devices using image sensors, such as SLR cameras, general digital cameras, video cameras, mobile phones, automotive electronics, and so on. Conventional image sensors may be fabricated from complementary metal oxide semiconductor (CMOS) technology or charge coupled device (CCD) technology. A typical image sensor operates as follows: Light is incident on a microlens, which focuses the light through a filter onto a photosensitive element. A photosensitive element converts light into an electrical signal proportional to the intensity of the incident light. In an image sensor, electrical signals in a photosensitive element are coup...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14623H01L27/1463H01L27/14683H01L27/14685
Inventor 丁琦陈世杰黄晓橹
Owner HUAIAN IMAGING DEVICE MFGR CORP
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