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Absorption method of warped wafer and device using absorption method

A wafer and warping technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems that affect yield, reduce wafer warpage, and wafers cannot be adsorbed, so as to reduce costs, The effect of improving the yield rate

Active Publication Date: 2018-06-26
DYNAX SEMICON
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There are usually multiple suction holes on the suction cup to better fix the wafer. When the wafer is flat or only slightly warped, the suction cup can absorb the wafer and reduce the warpage of the wafer; but when the wafer When the deformation is serious, there will be a vacuum leak between the chuck and the wafer, which will cause the wafer to be unable to be adsorbed, resulting in rejection of the wafer, which greatly affects the yield

Method used

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  • Absorption method of warped wafer and device using absorption method
  • Absorption method of warped wafer and device using absorption method
  • Absorption method of warped wafer and device using absorption method

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Embodiment Construction

[0035] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0036] Preferred embodiment:

[0037] This preferred embodiment discloses an adsorption method for a warped wafer. The adsorption method is to use a normal wafer to form a normal adsorption state on the chuck 1, then use a warped wafer 2 to replace the normal wafer, and adjust the position of the warped wafer 2 on the chuck 1 horizontally and / or rotate until it is warped. The curved wafer 2 is adsorbed on the chuck 1 .

[0038] The production and processing of semiconductor wafers takes a relatively long time, especially those wafers with more complicated processing procedures. At the final stage of the entire processing (such as engraving metal wiring or pressing points), it is found that some products cannot be processed due to warping and deformation. Re-introduction of a certain amount of prod...

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Abstract

The invention discloses an absorption method of a warped wafer and a device using the absorption method, belongs to the technical field of semiconductors, and is designed for solving the problem thatabsorption for an existing warped wafer is impossible. The method includes the steps of using a normal wafer to form an absorption normal state on a sucker, using a warped wafer to replace the normalwafer; horizontally adjusting and / or rotationally adjusting the position of the warped wafer on the sucker until the warped wafer is absorbed on the sucker. The device comprises the sucker connected to a vacuum system, a plurality of suction holes formed in the sucker, and a control switch arranged on the vacuum system. According to the method for absorbing warped wafers, the wafers are not abandoned because of warping, so that as many wafers as possible can be successfully cut into chips. The rate of finished products is improved, and the cost is reduced. The device disclosed by the inventioncan be used for photoetching the warped wafer by using the absorption method, so that the wafers are prevented from being abandoned, and the photoetching effect is good.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an adsorption method for a warped wafer and a device using the adsorption method. Background technique [0002] In the semiconductor manufacturing process, a large amount of stress will inevitably accumulate on the wafer after going through multiple processes, resulting in partial or total warping of the wafer, and even when the stress exceeds the limit that the wafer can withstand resulting in chipping of the wafer. [0003] The exposure process needs to place the wafer on the suction cup, absorb and fix it through the vacuum suction hole on the suction cup, and then perform photolithography on the wafer. There are usually multiple suction holes on the suction cup to better fix the wafer. When the wafer is flat or only slightly warped, the suction cup can absorb the wafer and reduce the warpage of the wafer; but when the wafer When the deformation is severe, a vacuum le...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67259H01L21/67271H01L21/6838
Inventor 陈明辉
Owner DYNAX SEMICON
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