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Window opening method of prepreg, manufacturing method of high-speed backplane and high-speed backplane

A technology of prepreg and manufacturing method, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, laminated printed circuit boards, etc., can solve the problems of black hole edges, difficulty in separation, poor hole shape, etc., and prevent black hole edges , good hole shape, and the effect of preventing adhesion together

Active Publication Date: 2019-11-05
DONGGUAN SHENGYI ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to provide a method for opening a window of a prepreg, a method for making a high-speed backplane, and a high-speed backplane, so as to overcome the difficulty in separating the prepregs in the prior art due to melting at high temperature, blackening of the edge of the hole, and poor hole shape. defect

Method used

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  • Window opening method of prepreg, manufacturing method of high-speed backplane and high-speed backplane
  • Window opening method of prepreg, manufacturing method of high-speed backplane and high-speed backplane
  • Window opening method of prepreg, manufacturing method of high-speed backplane and high-speed backplane

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Embodiment 2

[0045] see Figure 5 , the present embodiment provides a method for manufacturing a high-speed backplane, comprising steps:

[0046] Step 201, according to the normal technological process, fabricate the first sub-board and the second sub-board respectively.

[0047] Step 202 , according to the normal technological process and design requirements, respectively perform operations such as drilling, counterbore electroplating, inner layer pattern making, and surface treatment on the first sub-board and the second sub-board.

[0048] In step 203 , window opening is performed on several low-fluidity prepregs to be stacked between the first sub-panel and the second sub-panel.

[0049] In this step, the window opening method of the low fluidity prepreg includes:

[0050] Stack at least one prepreg and at least two heat sinks, and each prepreg is located in the middle layer of the two heat sinks;

[0051] Fix the laminated prepreg and heat sink into one body to form a multi-layer s...

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Abstract

The invention relates to the technical field of PCBs (printed circuit boards) and discloses a windowing method of a prepreg, a manufacturing method of a high-speed backplane and the high-speed backplane. The windowing method of the prepreg comprises steps as follows: at least one prepreg and at least two cooling fins are stacked, and each prepreg is located between two cooling fins; the stacked prepreg and the cooling fins are fixed integrally to form a multilayer structure; drilling is performed on a plurality of preset windowing positions of the multilayer structure; the prepreg is separatedfrom the multilayer structure. The cooling fins are stacked between the prepregs, the cooling fins are utilized in the drilling process for effective cooling, melting caused by too high temperature of the windowing area of the prepregs is avoided, the conditions that multiple prepregs stick together and blackening happens to hole edges are prevented, and good hole patterns are acquired.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for opening a window of a prepreg, a method for manufacturing a high-speed backplane and the high-speed backplane. Background technique [0002] With the high integration of electronic components on the circuit board and the increase in the number of I / O, the advancement of electronic assembly technology, the high-frequency and high-speed digital development of signal transmission, and the upgrading and replacement needs of the rapid development of electronic equipment, PCB has gradually become The direction of bearing function sub-boards, signal transmission and power transmission is developing, while its signal processing function is gradually weakening. This type of PCB is the backplane. Backplane (Backplane or Back panel) refers to a type of printed circuit board with lines and many rows of jacks, mainly used to carry other ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0058H05K3/4611
Inventor 何思良王小平纪成光金侠
Owner DONGGUAN SHENGYI ELECTRONICS