Double-station pump vacuum processor with uniform vacuumizing function

Abstract

The invention relates to a double-station pump vacuum processor with a uniform vacuumizing function. The double-station pump vacuum processor is provided with two vacuum processing chambers, an offsetair extraction opening and a vacuum pump, wherein the two vacuum processing chambers can be used as process processing chambers, the offset air extraction opening is shared by and is communicated with the two vacuum processing chambers; damping bodies having a set thickness are arranged in regions in the vacuum processing chambers along the vertical direction of the regions, wherein the regions are adjacent to the offset air extraction opening, and therefore, the air extraction rate of an air extraction opening near end can be decreased, so that the air extraction rate of the air extraction opening near end and the air extraction rate of an air extraction opening remote end can be balanced, and therefore, the influence of the offset of the chambers on process processing uniformity can bedecreased; and channels communicated with the external atmospheric environment of the chambers can be formed inside ribs adopted as the damping bodies, and therefore, connection between cables in thechambers and the outside can be facilitated.

Description

technical field [0001] The invention relates to a vacuuming technology of a plasma processing device, in particular to a double-station vacuum processor for uniform vacuuming. Background technique [0002] The pressure control of the process in the etching equipment, the uniformity of the etching index, etc., are all related to the design of the vacuum processing chamber. Compared with single-chamber equipment with only one vacuum processing chamber, the equipment designed with multi-station vacuum processor has higher output: for example, a double-station vacuum processor is equipped with two vacuum processing chambers for engraving respectively. Etching treatment improves production efficiency; the two chambers share a set of vacuum pumps, throttle valves, control units and other components of the vacuum generating circuit, which can save costs, effectively save space, and make the product compact. [0003] In single-chamber equipment with only one vacuum processing chamb...

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Problems solved by technology

[0004] In this way, for each vacuum processing chamber of the double-station vacuum processor, the eccentric suction port is asymmetrically positioned in the cavity (deviating from the concentric suction port corresponding to the single cavity); then the distance in each vacuum processing chamber is eccentric The position closer to the suction port has a faster pumping rate and is easy to be pumped to a lower pressure, but the position farther from the eccentric suction port will affect the pumping rate and pressure due to the longer path. It is very easy to cause uneven etching in the 0~360° direction

In addition, the vacuum volume of the double-station vacuum processor increases, resulting in an increase in the load of the vacuum pump, which makes it difficult to achieve the vacuum degree required by the process, and it is difficult to achieve a balance between "high output" and "high performance". Application of Work Station Vacuum Processor in High Performance Etching Process

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