Thermal bubble ink jet printing head chip and manufacturing method thereof

Abstract

The embodiment of the invention provides a thermal bubble ink jet printing head chip and a manufacturing method of the thermal bubble ink jet printing head chip and relative to the technical field ofprinting. The thermal bubble ink jet printing head chip comprises a substrate and a heating resistor formed on the first side of the substrate. The side, far away from the substrate, of the heating resistor is provided with an ink containing cavity. A low-heat-conductivity cavity is formed in the substrate and located on the side, far away from the ink containing cavity, of the heating resistor. Amaterial with the heat conductivity lower than that of the substrate is fed in the low-heat-conductivity cavity. Diffusion of the heat generated by the heating resistor to the substrate is correspondingly reduced by the adoption of the low-heat-conductivity cavity, namely the heat is kept in the ink containing cavity, and the heating efficiency of the heating resistor is improved; in this way, the work current of the heating resistor can be correspondingly lowered, the integrated print wide format of digital wide-format print equipment is improved, meanwhile the work current of a printing head and the temperature rising rate of the substrate are reduced, and therefore the printing speed of the high-speed digital wide-format print equipment is improved.

Description

technical field [0001] The embodiments of the present invention relate to the field of printing technology, and in particular to a thermal bubble jet printing head chip and a manufacturing method thereof. Background technique [0002] The thermal bubble jet print head chip of high-speed digital wide-format printing equipment has the advantages of mass production, high resolution, and low cost, and is widely used. Its working principle is that the tiny resistance of the thermal bubble inkjet print head chip will generate a large amount of heat in a very short time under the action of a large current, causing the ink in the resistance area to vaporize instantly to form bubbles and expand rapidly, forcing the ink to be ejected. [0003] In order to further increase the integrated printing width of the wide-format printing device, the print head needs to apply a current up to several amperes, which results in a high manufacturing cost and usage cost of the printing device. In a...

AI Technical Summary

Problems solved by technology

[0003] In order to further increase the integrated printing width of wide-format printing equipment, the print head needs to apply a current of up to several amperes, resulting in a large manufacturing cost and use cost of the printing equipment

In addition, the temperature of the circuit components in the print head will rise rapidly under the action of high current, and the performance will be affected, thereby affecting the printing quality. In order to ensure the printing quality, the print head needs to work periodically

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