Method for removing lamination rivet on lamination plate
A technology of pressing plates and rivets, which is used in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of broken needles and partial holes, prone to broken needles and partial holes, and high incidence, so as to reduce wear and tear and reduce partial holes. The probability of holes and broken needles, the effect of saving maintenance costs
Inactive Publication Date: 2018-07-06
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
The drilling process of the printed circuit board is essentially the cutting of the printed circuit board by the drill. The larger the diameter of the drill, the greater the resistance during the drilling process, and the greater the wear on the spindle of the drilling rig. If you use a large drill for a long time Production will not only increase the maintenance cost of the drill spindle, but also cause the drill to be prone to broken needles and partial holes when drilling with small drill nozzles, especially when drilling tiny holes, the phenomenon of broken needles and partial holes is high
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[0016] refer to figure 1 , the present invention provides a kind of method for removing the pressing rivet on the pressing plate, specifically comprises the following steps:
[0017] S1. Arrange six holes 2 in a quincunx shape to set up the drill strip material, wherein each hole 2 is evenly arranged around the axis of the compression rivet 1, and the edge of each hole 2 needs to cover the axis of the compression rivet 1. After each hole 2 is arranged in a quincunx shape, it needs to completely cover the press-fit rivet 1; the hole 2 is drilled with a drill bit with a diameter of 3.175mm.
[0018] S2. Drill holes 2 on the press-fit plate 3 sequentially using the above-mentioned drill tape materials, gradually covering the press-fit rivets 1 until the press-fit rivets 1 are completely removed.
[0019] The present invention covers the hole 2 of the press-fit rivet 1 by drilling several holes on the press-fit plate 3 in a quincunx arrangement, so as to completely drill out the ...
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The invention relate to the field of a printed circuit board, in particular to a method for removing a lamination rivet on a lamination plate. The method comprises the step of drilling a plurality ofholes in the lamination plate, wherein each hole is arranged on the lamination plate in a plum shape and is drilled, and each hole completely covers the lamination rivet. The plurality holes coveringthe lamination rivet are drilled in the lamination plate according to a mode of plum-shaped arrangement and are used for completely drilling the lamination rivet, so that the lamination rivet can be completely removed by employing a small drill; and the diameter of the drill is reduced to 3.175 millimeters or below from 5.0 millimeters or above, so that the wear to a main shaft of a drilling machine caused by drilling of a large drill on the lamination rivet is reduced, the probability of hole shift and pin breakage caused by drilling of the small drill of the drilling machine is reduced, andthe maintenance cost is reduced.
Description
technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for removing a pressing rivet on a pressing board. Background technique [0002] At present, the printed circuit board needs to be riveted with pressure rivets before pressing the inner board, and the pressure rivets need to be removed after pressing. If the pressure rivets are not removed, it will lead to hidden potions and burst holes in the subsequent production process. and other quality issues. In the context of improving production efficiency, most manufacturers drill out the press-fit rivets at one time during the drilling process, and usually use a drill with a drill diameter of ≥5.0mm to drill out the press-fit rivets. The drilling process of the printed circuit board is essentially the cutting of the printed circuit board by the drill. The larger the diameter of the drill, the greater the resistance during the drilling process, and the greater the wear on...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/0214
Inventor 莫崇慧莫崇明刘东杜明星
Owner SHENZHEN SUNTAK MULTILAYER PCB