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Evaporation method and evaporation system

An evaporation and target technology, which is applied in vacuum evaporation coating, sputtering coating, ion implantation coating and other directions, can solve the problem of low utilization rate of target molecules and achieve the effect of improving utilization rate

Active Publication Date: 2019-09-13
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present invention provides an evaporation method and an evaporation system, which can solve the problem of low utilization rate of target molecules in the process of vacuum evaporation process in the related art

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  • Evaporation method and evaporation system
  • Evaporation method and evaporation system

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Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0035] See figure 1 , which shows a schematic diagram of the implementation environment involved in the evaporation method provided in some embodiments of the present invention. The implementation environment may include: a substrate to be evaporated 110 , an evaporation target 120 and a vacuum chamber 130 . Wherein, the substrate to be evaporated 110 and the evaporation target 120 are located in the vacuum chamber 130, and when the evaporation target 120 is heated, the target molecules will be detached from the evaporation target 120 and ejected, and the ejected target Molecules are attached to predetermined regions of the substrate to be evaporated 110 to form desired patterns.

[0036] The embodiment of the present invention provi...

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Abstract

The invention discloses an evaporation plating method and an evaporation plating system and belongs to the technical field of display. The evaporation plating method comprises the steps that an evaporation plating target material is heated in a vacuum cavity, target material molecules are made to break away from the heated evaporation plating target material and are jetted out so as to be attachedto a substrate about to be subjected to evaporation plating, and the temperature of the substrate about to be subjected to evaporation plating is less than that of the evaporation plating target material; rectangular ultrasonic waves are output from the side, far away from the evaporation plating target material, of the substrate about to be subjected to evaporation plating to enable the target material molecules attached to a first region of the substrate about to be subjected to evaporation plating to move close to the evaporation plating target material and to be attached to the evaporation plating target material. Through the evaporation plating method, the problem that the utilization rate of the target material molecules is low in the vacuum evaporation plating process in related technologies is solved, and the effect of increasing the utilization rate of the target material molecules is achieved. The evaporation plating method and the evaporation plating system are applied to vacuum evaporation plating.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an evaporation method and an evaporation system. Background technique [0002] At present, the vacuum evaporation process is one of the important processes for making organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screens. desired pattern. [0003] In the related art, when the vacuum evaporation process is performed on the substrate to be evaporated, the mask plate and the substrate to be evaporated are usually placed in a vacuum chamber, and then the evaporation target is heated so that the target molecules are evaporated from The target is detached and emitted, and then attached to the substrate to be evaporated through the light-transmitting area of ​​the mask to form the desired pattern. [0004] In the process of realizing the present invention, the inventor found that the above-mentioned method has at least the following defects: during the vac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/12
Inventor 万冀豫张大成
Owner BOE TECH GRP CO LTD