DMD structure XY multi-shaft movable optical path direct writing exposure machine

An exposure machine and optical path technology, which is applied in the field of DMD structure XY multi-axis movable optical path direct writing exposure machine, can solve the problems of inability to produce super large boards, inaccurate focus and positioning, and air leakage of vacuum suction cups, so as to improve exposure accuracy and Stability of operation, accurate exposure position, and no edge lifting effect

Pending Publication Date: 2018-07-20
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In view of the above problems, the present invention provides a vacuum chuck and a DMD structure XY multi-axis movable optical path direct writing exposure machine containing the vacuum chuck, so as to solve the problem that the existing technology cannot produce super large boards, the vacuum chuck leaks, and the focusing and positioning during the exposure process Inaccurate and other issues

Method used

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  • DMD structure XY multi-shaft movable optical path direct writing exposure machine
  • DMD structure XY multi-shaft movable optical path direct writing exposure machine
  • DMD structure XY multi-shaft movable optical path direct writing exposure machine

Examples

Experimental program
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Effect test

Embodiment 1

[0073] Example 1: Vacuum chuck

[0074] The vacuum chuck structure of the present invention is as Figure 1-2 shown.

[0075] The vacuum suction cup of the present invention includes a suction cup main body 1 and a vacuum generating device 2; a certain number of air holes 3 are distributed in the form of rows and columns on the suction cup main body 1, each row of air holes 3 corresponds to a relay 4, and each column of air holes 3 also corresponds to one A relay 4; an air hole switch 5 is connected between each air hole 3 and the vacuum generating device 2; the air hole switch 5 is connected to the relay 4 in the row where the air hole 3 is located and the relay 4 in the column where the air hole 3 is located.

[0076] Each relay 4 is connected to the overall control device 6 . The air hole switch 5 is located on the vacuum pipeline connected between the air hole 3 and the vacuum generating device 2 . The air hole switch 5 may be an electromagnetic switch. The air holes 3...

Embodiment 2

[0078] Example 2: Vacuum chuck

[0079] The vacuum chuck of the present embodiment, in embodiment 1 such as Figure 1-2 A modified version of the vacuum cup shown.

[0080] The air holes 3 on the main body 1 of the suction cup are distributed sparsely in the middle and densely around.

[0081] In traditional vacuum chucks, the air holes are generally evenly distributed. When producing a small PCB, it is possible that after the substrate 14 is placed on the main body of the suction cup, a certain edge of the substrate is located far away from the air holes on both sides (such as image 3 As shown), the edge part will be lifted due to the lack of vacuum suction, which will affect the production. After adopting the distribution form of the present invention, which is sparse in the middle and dense around, such as Figure 4-5 As shown, when a small substrate is placed on the vacuum chuck, choose to place the substrate close to the edge of the suction cup body. Move to the near...

Embodiment 3

[0085] Example 3: DMD structure XY dual-axis movable optical path direct writing exposure machine

[0086] Take the DMD structure XY dual-axis movable optical path direct writing exposure machine with two moving components as an example to illustrate.

[0087] Such as Image 6 Shown is a DMD structure XY dual-axis movable optical path direct writing exposure machine containing the vacuum chuck of the present invention.

[0088] The DMD structure XY dual-axis movable optical path direct writing exposure machine includes a support structure 7, a DMD structure 8, a DMD structure stepping axis 9, a plurality of moving components, and a vacuum chuck 10; each moving component includes a stepping X axis 11 , a scanning Y-axis 12 and a lifting Z-axis 13; the vacuum chuck 10 is located above the moving assembly.

[0089]The DMD structure 8 is installed on the DMD structure stepping shaft 9 and can move along the guide rail with the slider of the DMD structure stepping shaft 9 . The ...

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Abstract

The invention discloses a DMD structure XY multi-shaft movable optical path direct writing exposure machine, and belongs to the technical field of direct writing exposure. According to the DMD structure XY multi-shaft movable optical path direct writing exposure machine, mainly the structure of the vacuum suction disk is improved, such that the problem that the suction is insufficient due to the gas leakage during the production of the small plate is effectively solved; and further the gas pores are sparsely distributed in the middle of the suction disk and are densely distributed on the periphery of the suction disk, such that the problem of the plate edge warpage is effectively eliminated, the number of the gas pores is saved, and the cost is reduced. According to the present invention,with the DMD structure XY multi-shaft movable optical path direct writing exposure machine, the 55-inch super-large plate can be produced; the two groups of the movement assemblies are respectively connected to the left side and the right side below the suction disk, and the movement shafts of the two groups of the movement assemblies synchronously move so as to improve the exposure precision andthe operation stability; and by improving the partition alignment focusing method, the accurate image exposure position and the clear image expose can be ensured.

Description

technical field [0001] The invention relates to a DMD structure XY multi-axis movable optical path direct writing exposure machine, which belongs to the technical field of direct writing exposure. Background technique [0002] PCB (printed circuit board) is the support body of electronic components, and also the carrier of electrical connection of electronic components. Common PCB production equipment includes traditional exposure machines, multi-prism structure laser direct writing exposure machines, DMD structure laser direct writing exposure machines, etc. The laser direct writing exposure machine can directly image the image on the PCB board. Compared with the traditional exposure machine, it does not need to use film, and the formed image is clearer. [0003] As the market's functional requirements for PCB boards are getting higher and higher, PCB boards are becoming more and more complex, and system compatibility is higher. Sometimes a large substrate is required. How...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/70808G03F7/2055
Inventor 李显杰
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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