Rivet punching jig of thin core board

A technology of rivets and core boards, which is applied in the manufacture of multilayer circuits, electrical components, printed circuits, etc., can solve the problems of poor electrical properties, lack of fixation, misalignment between layers, etc., and achieve light overall weight, Good positioning effect and convenient operation

Inactive Publication Date: 2018-07-20
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The third method is rivet riveting, that is, before pressing, after the substrate and PP are assembled, the substrates of each layer are fixed together by rivets, so that it is not easy to slip during the pressing process to avoid layer The layer deviation caused by the misalignment between the layers, but because the thin plate Core itself is thin and brittle, it is partially broken due to the instantaneous external mechanical force during the riveting process, so that it does not have a good fixing effect, and often causes interlayer misalignment offset, resulting in poor electrical

Method used

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  • Rivet punching jig of thin core board
  • Rivet punching jig of thin core board

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Embodiment Construction

[0017] Such as figure 1 As shown, a thin plate core plate rivet fixture includes a copper-free substrate 1, and also includes a rivet hole 2, a slot hole 3 and a window 4; the four corners of the copper-free substrate 1 are provided with rivet holes 2, A slot 3 is provided on each side of the copper-free substrate 1; two windows 4 are respectively opened on the upper and lower sides of the copper-free substrate 1, and one window 4 is opened on each side of the two sides.

[0018] The diameter of the rivet hole 2 is 3.175mm. The size of the slot 3 is 280*187mil. The window 4 is 5cm*5cm.

[0019] In the present invention, four rivet holes 2 of 3.175mm are drilled on the corners of the copper-free substrate 1, the purpose is to reserve the rivet holes for joining two copper-free substrates 1 together; Punch out 4 more slotted holes 3 (size 280*187mil); then remove 6 windows 4 of 5cm*5cm from the position where the rivet needs to be riveted.

[0020] Such as figure 2 As show...

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Abstract

The invention relates to a rivet punching jig of a thin core board, and belongs to the technical field of industry of a printed circuit board (PCB in short). The rivet punching jig comprises a copper-free substrate and also comprises riveting holes, groove holes and windows, wherein the riveting holes are formed in four corners of the copper-free substrate, each groove hole is formed in each edgeof the copper-free substrate, the two windows are respectively formed in an upper edge and a lower edge of the copper-free substrate, and each window is formed in each side edge of the two side edges.The jig provided by the invention can have a fixing and supporting effect during rivet punching, a core at an inner layer is difficult to break, so that layer drift is also prevented; the jig employsa groove PIN to position, the whole positioning effect is relatively good, and a PIN hole is also prevented from being damaged by sleeving during operation of a worker; and the jig is fabricated by employing the copper-free substrate, the whole weight is relatively light, and the worker is convenient to operate.

Description

technical field [0001] The invention relates to a riveting jig for a thin plate core board, in particular to a multi-layer circuit board (≥6 layers) that is laminated at one time, and belongs to the technical field of the printed circuit board (hereinafter referred to as PCB) industry. Background technique [0002] As the support body of electronic components, PCB is the carrier of electrical connection of electronic components. In the development history of hundreds of years, PCB has developed from single layer to double layer and multilayer board. Due to the continuous development of high precision, high density, Fine aperture, fine wire, fine pitch, high reliability, high-speed transmission, light weight, multi-layer, and thin development, thus driving the rapid development of multi-layer sheet. [0003] A process that multilayer boards often need to go through in the PCB industry is called lamination. Its function is to melt and re-solidify multiple different thin Core s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46B21J15/38
CPCH05K3/4638B21J15/38
Inventor 邹伟
Owner GULTECH WUXI ELECTRONICS CO LTD
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