Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for improving uniformity in electroplating

A technology of uniformity and electroplating solution, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of large random distribution trend and poor uniformity of the whole plate, and achieve the effect of simple method, good quality and improved uniformity.

Inactive Publication Date: 2018-07-24
江西芯创光电有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the electroplating methods used are vertical electroplating. Taking copper as an example, if the existing electroplating tank is used, if the control is not good, the "dog bone effect" will easily appear after the copper is electroplated on the circuit board, that is, the surrounding copper is very thick, and the middle area is thin. The uniformity of the whole board is poor and the distribution trend is random

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for improving uniformity in electroplating
  • Method for improving uniformity in electroplating
  • Method for improving uniformity in electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The main body of the experiment is a high-precision carrier board applied to IC packaging. The main body of electroplating is the sub-mother slot of the shielding electrode line, and the area of ​​the sub-slot cathode (plate required) and the anode electrode line is 1:1. The temperature range of the electroplating solution is controlled at 20 degrees Celsius, and the current density is controlled at 10 amps / square foot. The electroplating solution includes copper sulfate pentahydrate, and the concentration of copper sulfate is controlled at 175 grams per liter, and the sulfuric acid is at 150 grams per liter.

[0014]

[0015] Table 1

[0016] Table 1 shows the experimental conditions of common electroplating methods and methods for improving uniformity in electroplating.

[0017]

[0018]

[0019] Table 2

[0020] Table 2 shows the thickness data of multiple points on the two substrates after the two electroplating methods (the 25 points are the corresponding...

Embodiment 2

[0024] The main body of the experiment is a high-precision carrier board applied to IC packaging. The main body of electroplating is the sub-mother slot of the shielding electrode line, and the area of ​​the sub-slot cathode (plate required) and the anode electrode line is 1:1. The temperature range of the electroplating solution is controlled at 22 degrees Celsius, and the current density is controlled at 18 amps / square foot. The electroplating solution includes copper sulfate pentahydrate, the concentration of copper sulfate is controlled at 200 grams per liter, and the sulfuric acid is at 175 grams per liter.

[0025]

[0026]

[0027] Table 1

[0028] Table 3 shows the experimental conditions of common electroplating methods and methods for improving uniformity in electroplating.

[0029] serial number

array 1

array 2

1

13.40

14

2

12

14.1

3

11.9

13.8

4

12.6

13.3

5

12.9

14.2

...

Embodiment 3

[0035] The main body of the experiment is a high-precision carrier board applied to IC packaging. The main body of electroplating is the sub-mother slot of the shielding electrode line, and the area of ​​the sub-slot cathode (plate required) and the anode electrode line is 1:1. The temperature range of the electroplating solution is controlled at 24 degrees Celsius, and the current density is controlled at 25 amps / square foot. The electroplating solution includes copper sulfate pentahydrate, the concentration of copper sulfate is controlled at 225 grams per liter, and the sulfuric acid is at 200 grams per liter.

[0036]

[0037] table 5

[0038] Table 5 shows the experimental conditions of common electroplating methods and methods for improving uniformity in electroplating.

[0039]

[0040]

[0041] Table 6

[0042] Table 6 shows the thickness data of multiple points on the two substrates after the two electroplating methods (25 points are the corresponding points ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for improving uniformity in electroplating. By the adoption of the method, the uniformity after electroplating is good. According to the technical scheme, the method is characterized by comprising the steps that a secondary-primary tank is adopted for an electroplating bath, the temperature of an electroplating solution is controlled to be within the range of 20-24DEG C, the current density is controlled at 10-25 amperes per square foot ( 10-25 ASF ), the electroplating solution comprises copper sulfate pentahydrate, the concentration of copper sulfate is controlled at 175-225 grams per liter, and sulfuric acid is controlled at 150-200 grams per liter; a substrate is vertically arranged or basically vertically arranged in an electroplating process; when the substrate is immersed in the secondary-primary tank for electroplating, the distances between the substrate and anodes on both sides are equal or nearly equal; and the electroplating process comprises the following steps that S1, primary copper electroplating is carried out on the substrate in the electroplating bath; and S2, then the substrate is taken out and turned up and down, the original upper end becomes the lower end, the original lower end becomes the upper end, the substrate is immersed in the electroplating bath for secondary copper electroplating, and after finishing, the substrate is taken out.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a method for improving uniformity in electroplating. Background technique [0002] At present, electroplating is widely used on semiconductor chips for electroplating layered or point-like structures. Most of the electroplating methods used are vertical electroplating. Taking copper as an example, if the existing electroplating tank is used, if the control is not good, the "dog bone effect" will easily appear after the copper is electroplated on the circuit board, that is, the surrounding copper is very thick, and the middle area is thin. The uniformity of the whole board is poor and the distribution trend is random. [0003] Therefore, in order to solve the above problems, some use more expensive electroplating devices, and some use special electroplating solution formulations, each of which has its own advantages and defects. Instead of mainly relying on the plating de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D3/38C25D5/10C25D21/12
CPCC25D3/38C25D5/10C25D21/12
Inventor 袁晋
Owner 江西芯创光电有限公司