Pedestal for enhancing temperature uniformity
A uniformity and susceptor technology, which is applied in the field of susceptors to improve temperature uniformity, can solve problems such as the inability to ensure the level of the susceptor, the increase in the defect rate of the processed object, and the decrease in the temperature uniformity of the susceptor, so as to reduce the incidence of defects , stable placement, and the effect of improving temperature uniformity
Active Publication Date: 2018-07-24
合肥微睿科技股份有限公司
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- Application Information
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Problems solved by technology
The original base has the problem that the temperature of the central part of the electric heating plate at the position of the support frame is lower than that of other parts. As a single fixed, can not ensure the level of the base
Method used
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0018] refer to Figure 1-2 , a base for improving temperature uniformity, including a main body 1, an electric heating plate 2 is fixed inside the main body 1, and an insertion groove 11 is provided at the bottom end of the electric heating plate 2, and one end of the insertion groove 11 communicates with the connecting groove 10, and the connecting groove 10 Set in the middle of the electric heating plate 2, and the middle of the electric heating plate 2 is provided with a thermal sensor slot 9, the bottom end of the body 1 is fixed with a cover plate 3, the inside of the cover plate 3 is provided with a chute 8, and the top of the chute 8 The inner wall is connect...
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The invention discloses a pedestal for enhancing temperature uniformity. The pedestal comprises a body which is internally provided with an electric heating plate in a fixing way. The bottom end of the electric heating plate is provided with an inserting groove. One end of the inserting groove is communicated with a connecting groove. The connecting groove is arranged in the middle part of the electric heating plate, and the middle part of the electric heating plate is provided with a heat inductor groove. The bottom end of the body is provided with a cover plate in a fixing way. The cover plate is internally provided with a slide groove. The internal wall of the top end of the slide groove is connected with a rolling ball in a rolling way. The tolling ball is installed on the top end of asupporting frame. One side of the supporting frame is provided with an auxiliary electric heating plate in a fixing way. An auxiliary electric heating line is laid in the auxiliary electric heating plate. One end of the supporting frame and one end of a rotating shaft are welded and fixed. One end, which penetrates through the cover plate, of the rotating shaft and one end of a screw cap are welded and fixed. According to the pedestal for enhancing the temperature uniformity, the temperature of the central part of the electric heating plate is enhanced so that the overall temperature uniformity is enhanced, and the effect of significantly reducing the reject ratio of the processed object in the evaporation process can be obtained.
Description
technical field [0001] The invention relates to the technical field of bases, in particular to a base with improved temperature uniformity. Background technique [0002] Under normal circumstances, the process of evaporating or etching thin films on wafers and glass bases will be carried out in semiconductor engineering equipment including vacuum chambers. Semiconductor engineering equipment, such as chemical vapor deposition equipment, will include supporting wafers And the base of the glass base, the chamber equipped with the aforementioned base, and the equipment for forming the film. The original base is composed of a heating plate and a cooling plate. The heating plate includes a heating wire as heating means, and the cooling plate includes cooling means. The heating plate is formed with an insertion groove for inserting the heating wire, and the cooling plate is formed with a cooling means insertion groove for inserting the cooling means. The central part of the elec...
Claims
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Login to View More IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67098H01L21/68714
Inventor 朴相明沈国宝
Owner 合肥微睿科技股份有限公司