Electronic component package

A technology for electronic components and cover plates, which is applied in the field of electronic components and devices, can solve the problems of multiple manpower and material resources, consumption, and complicated processes, and achieve the effect of ensuring effectiveness.

Inactive Publication Date: 2018-07-24
河南新静亚米电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are various types of packaging currently available. Most of them are embedded with resin in the shell, and some are pasted by glue through high-temperature baking. The process is generally more complicated, and more manpower is required in actual production. material resources

Method used

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  • Electronic component package
  • Electronic component package
  • Electronic component package

Examples

Experimental program
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Embodiment Construction

[0017] The present invention will be further described below in conjunction with accompanying drawing.

[0018] Such as figure 1 , figure 2 , image 3 The electronic component package shown includes a base plate 1 and a cover plate 2 .

[0019] Both sides of the bottom plate 1 are provided with inverted L-shaped gussets 101, both sides of the cover plate 2 are respectively provided with ear plates 201 corresponding to the gussets 101, and the middle of the cover plate 2 is provided with a groove 202 for placing electronic components. ; The rear portion of the base plate 1 is also provided with an L-shaped lock plate 102, the inside of the lock plate 102 is provided with an upwardly concave lock groove 103, and the rear portion of the cover plate 2 is provided with a lock tooth 203 corresponding to the lock groove 103; the cover plate 2 passes through The lug plate 201 is slidably inserted into the buckle plate 101 , and is limited by the cooperation of the lock tooth 203 a...

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PUM

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Abstract

The invention relates to an electronic component package. Inversed-L-shaped buckling plates are arranged at two sides of a bottom plate; lug plates corresponding to the buckling plates are respectively arranged at two sides of a cover plate; the rear part of the bottom plate is provided with an L-shaped locking plate; a locking groove which is recessed upwards is formed in the locking plate; the rear part of the cover plate is provided with a locking tooth corresponding to the locking groove; the cover plate is slidably inserted into the buckling plates through the lug plates and is limited bymeans of the matching of the locking tooth and the locking groove; pins extending to the outside are arranged on the bottom plate; a perforated semi-circular adhesive groove is formed in the front part of the bottom plate; a perforated semi-circular adhesive groove corresponding to the perforated semi-circular adhesive groove of the bottom plate is formed in the cover plate; after the bottom plate and the cover plate are installed, the adhesive grooves are in butt joint with each other so as to form a circular adhesive groove; and an adhesive is injected into the circular adhesive groove. According to the electronic component package of the invention, the bottom plate and the cover plate which are corresponding to each other in a vertical direction are adopted; the bottom plate and the cover plate are bonded together, so that packaging can be realized. The electronic component package has the advantages of structural simplicity, relatively simple process flow and good actual use effect.

Description

technical field [0001] The present invention relates to electronic component devices, in particular to electronic component packaging. Background technique [0002] Packaging is the process of assembling the integrated circuit into a new final product. In actual use, it is mainly for loading the integrated circuit, then leading it out, and fixing it into a whole. There are also packages for individual electrical components to form a patch type The structure is convenient for mounting on the circuit board. [0003] There are various types of packaging currently available. Most of them are embedded with resin in the shell, and some are pasted by glue through high-temperature baking. The process is generally more complicated, and more manpower is required in actual production. physical resources. Contents of the invention [0004] The present invention is an electronic component package, which adopts the form of a bottom plate and a cover plate corresponding to the upper an...

Claims

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Application Information

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IPC IPC(8): H01L23/13
CPCH01L23/13
Inventor 潘静静
Owner 河南新静亚米电子科技有限公司
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