Power device heat dissipation structure
A technology of power devices and heat dissipation structures, which is applied in the direction of electrical components, circuit heating devices, printed circuit components, etc., can solve the problems of many power devices, the inability to install radiators, and the inability to dissipate heat for each power device, so as to achieve a good heat dissipation effect Effect
Pending Publication Date: 2018-07-24
HENGDIAN GRP INNUOVO ELECTRIC
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, due to the limitation of the space where the circuit board is located, many radiators cannot be installed
The structure of the existing heat sink is complicated, and there are too many power devices on the circuit board, and the existing heat sink cannot dissipate heat for each power device
Method used
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[0014] The present invention will be further described below according to the accompanying drawings and specific embodiments.
[0015] Depend on Figure 1 to Figure 4 As shown, a power device cooling structure of the present invention includes a circuit board 1, a radiator 2 and a plurality of power devices 3 are arranged on the circuit board 1, the radiator 2 is made of a metal material, and the radiator 2 has at least two fixed part 21 and at least two heat dissipation parts 22, the surface of the circuit board 1 is provided with copper foil 11, the fixed part 21 of the heat dissipation block 2 and the pad 31 of the power device are welded and fixed on the circuit board 1, and the copper foil 11 is positioned on the fixed Between the part 21 and the circuit board 1, between the pad 31 and the circuit board 1, the fixed part 21 of the radiator 2 is arranged parallel to the circuit board 1, and the heat dissipation part 22 of the radiator 2 is arranged vertically with the circ...
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The invention aims to provide a power device heat dissipation structure which is simple in structure and capable of performing heat dissipation on multiple power devices. In order to achieve the aim,a technical scheme of the invention is adopted as follows: the power device heat dissipation structure comprises a circuit board, wherein a heat sink and a plurality of power devices are arranged on the circuit board; the heat sink is made of a metal material and comprises at least two fixing parts and at least two heat dissipation parts; copper foil is arranged on the surface of the circuit board; the fixing parts of the heat sink and bonding pads of the power devices are fixedly welded on the circuit board, and the copper foil is positioned between the fixing parts and the circuit board andbetween the bonding pads and the circuit board; the fixing parts of the heat sink are parallel to the circuit board; the heat dissipation parts of the heat sink and the circuit board are vertically arranged; every two heat dissipation parts are positioned between two fixing parts; the lower ends of the heat dissipation parts are connected with edges of the fixing parts; and connecting parts are arranged between the heat dissipation parts and the fixing parts.
Description
technical field [0001] The invention relates to a heat dissipation structure of a power device. Background technique [0002] There are many power devices on the circuit board, and the power devices will generate heat when they work. If the heat cannot be dissipated for a long time, the power devices will be burned and the performance of the equipment will also be affected. In order to dissipate heat from the power devices, more There are radiators. However, due to the limitation of the size of the space where the circuit board is located, many radiators cannot be installed. The structure of the existing heat sink is complicated, and there are too many power devices on the circuit board, so the existing heat sink cannot dissipate heat for each power device. Contents of the invention [0003] The object of the present invention is to provide a power device heat dissipation structure with simple structure and capable of dissipating heat for multiple power devices. [0004...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20H05K1/02
CPCH05K1/0203H05K7/2039H05K2201/066
Inventor 蒋伟国
Owner HENGDIAN GRP INNUOVO ELECTRIC