Heat dissipation system and heat dissipation method applied to light emitting surface of high-power LED lighting equipment

Abstract

The invention belongs to the technical field of heat dissipation, and discloses a heat dissipation system and heat dissipation method applied to the light emitting surface of high-power LED lighting equipment. The heat dissipation method is characterized in that a hydrogel is laid on the light emitting surface of the LED lighting equipment, and heat of the LED lighting equipment is taken away in time through evaporation of water contained in the hydrogel; and after the water in the hydrogel is continuously evaporated, water is supplemented to the hydrogel through a water supplementing device.According to the heat dissipation system and heat dissipation method applied to the light emitting surface of the high-power LED lighting equipment, the problems that in the prior art, an LED device is huge in system and high in working temperature, and heat dissipation can only be carried out on the LED backlight surface are solved; and the temperature of the light emitting surface of the high-power LED device can be controlled, and reduction of the light emitting quality of the LED device can be inhibited.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation system and method applied to the light-emitting surface of high-power LED lighting equipment. Background technique [0002] In recent years, with the continuous development of LED preparation technology and heat dissipation technology, LED has gradually replaced traditional light sources and become the current mainstream light source, widely used in construction, medical, military, aerospace and many other industries. Compared with traditional light sources (such as fluorescent lamps, metal halide lamps, and high-pressure mercury lamps), LEDs have the advantages of environmental protection and non-toxicity, high luminous efficiency, simple equipment, small size, and good adjustability. However, there are also some problems in the development of LEDs, the most prominent of which is heat dissipation. LED cooling methods can be divided into active coolin...

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Problems solved by technology

[0003] The embodiment of the present application provides a heat dissipation system and method applied to the light-emitting surface of high-power LED lighting equipment, which solves the problem in the prior art that the LED device system is huge, the working temperature is high, and heat dissipation can only be performed on the backlight surface of the LED.

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