A silicon wafer cleaning and drying integrated device and cleaning method thereof

Abstract

The invention discloses a silicon wafer cleaning and drying integrated device, which comprises a movable frame. A control cabinet, a cylinder, a lifting device, an automatic cover plate and a cleaningtank are arranged in the movable frame. The lifting device is arranged in a box body, a bracket for placing a silicon wafer carrying basket is disposed on one side of the box body, and the lifting device comprises a driving motor, a screw rod, a connecting rod and a connecting sleeve. The driving motor is disposed at the bottom surface of the box body. The driving motor drives the screw rod to rotate through a gear. A limiting slot is arranged at the lower part of the screw rod. The limiting slot is internally provided with a limiting block matched with the limiting slot. The silicon wafer cleaning and drying integrated device can realize the continuous up-down movement of the silicon wafer to be cleaned in the cleaning tank, improve the cleaning quality and the cleaning efficiency of thesilicon wafer; and nitrogen is introduced into an inner tank through a bubbling mouth to increase the fluidity and the turbulence of the cleaning liquid in the inner tank, and to enhance the cleaningeffect and drying effect of the cleaning solution on the surface of the silicon wafer.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer production, and in particular relates to a silicon wafer cleaning and drying integrated device and a cleaning method thereof. Background technique [0002] During the production process of silicon wafers, the surface of silicon wafers needs to be cleaned. The existing silicon wafer cleaning process is generally to place the silicon wafers in the silicon wafer carrying flower basket and use the cleaning solution for soaking and cleaning, or to rinse the carrying flower basket with running water. The silicon wafer in the cleaning solution is used to rinse the surface of the silicon wafer to realize the cleaning of the silicon wafer. When using this process to clean, because the silicon wafer hardly moves relative to the silicon wafer carrying flower basket, and the silicon wafer carrying flower basket does not move, relying only on water flow to rinse the surface of the silicon wafer, the clea...

AI Technical Summary

Problems solved by technology

When using this process to clean, because the silicon wafer hardly moves relative to the silicon wafer carrying flower basket, and the silicon wafer carrying flower basket does not move, relying only on water flow to rinse the surface of the silicon wafer, the cleaning force is small, the cleaning speed is slow, and it will cause the silicon wafer to be damaged. The surface of the silicon wafer is not cleaned uniformly and is difficult to clean, and it is difficult to dry the surface of the silicon wafer quickly

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