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Verification-repair tool and method of wafer adapter

A repair method and adapter technology, which are applied in the manufacturing of electric solid state devices, semiconductor devices, semiconductor/solid state devices, etc., can solve the problems of failure in the grasping process, difficult to repair equipment use standards, and high production costs

Active Publication Date: 2018-08-10
INTEL PROD CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the DTR device moves down to grab the adapter, there will be many factors that cause the adapter to deform. After the adapter deforms, it will cause the failure of the next grabbing process, which will cause the production equipment to alarm and stop. The current solution can only be through Replacing a new adapter while reducing the operating speed of the equipment to continue production, and the price of this wafer adapter is very expensive, and it is difficult to repair to the equipment use standard after deformation, so it can only be scrapped directly, resulting in extremely high production costs

Method used

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  • Verification-repair tool and method of wafer adapter
  • Verification-repair tool and method of wafer adapter
  • Verification-repair tool and method of wafer adapter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as Figures 1 to 8The wafer adapter verification repair tool shown includes a straightening table 1 , an identification aligner 2 , a top plane correction table 3 and a plane inspection instrument 4 . The correction table 1 is provided with a wafer correction groove 1.1, and the correction table 1 also provides a standard plane for the wafer adapter and the identification aligner 2, the top plane correction table 3 and the plane inspection instrument 4, and the top plane correction table When 3 is set on the correction table 1, the top plane correction table 3 also provides a standard plane for the wafer adapter. The correction table 1 provides a standard plane, which is processed by finishing. The surface of the standard plane of the correction table 1 is level, and the level difference of each point on the surface is <0.01mm. If there is no repair or the measurement error is large, the error cannot be strictly controlled, so the correction platform 1 is not only...

Embodiment 2

[0045] Such as Figures 1 to 8 As shown, the wafer adapter verification repair tool includes a correction station 1 , an identification aligner 2 , a top plane correction station 3 and a plane inspection instrument 4 . The correction table 1 is provided with a wafer correction groove 1.1, and the correction table 1 also provides a standard plane for the wafer adapter and the identification aligner 2, the top plane correction table 3 and the plane inspection instrument 4, such as Figure 5 and 6 , when the top plane correction table 3 is set on the correction table 1, the top plane correction table 3 also provides a standard plane for the wafer adapter. The correction table 1 provides a standard plane, which is processed by finishing. The surface of the standard plane of the correction table 1 is level, and the level difference of each point on the surface is figure 2 , 3 And 4, the straightening table 1 is made of steel, and its upper surface is a standard plane, and the wa...

Embodiment 3

[0047] The method for verifying and repairing the wafer adapter is characterized by comprising: a step of disassembling the wafer adapter, a step of component verification, a step of rectification, a step of repair verification and a step of assembling the wafer adapter.

[0048] The part verification step, by direct observation to determine the location of the obvious deformation on the wafer adapter part, the wafer adapter is placed on the standard plane of the correction table 1, using the identification aligner 2, the top plane correction table 3 and the plane inspection Instrument 4 checks to determine the slight deformation position of the wafer adapter; uses the correction groove 1.1 of the correction table 1 to verify whether the wafer adapter is used to connect with the machine to determine whether it is deformed.

[0049] In the correcting step, a mechanical deformation method is used to correct and repair the confirmed deformed positions on the wafer adapter part and...

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PUM

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Abstract

The invention discloses a verification-repair tool and method of a wafer adapter, and belongs to the technical field of precise repair operations. The tool comprises a corrosion table, an identification aligner, a top plane correction table and a plane detector, the corrosion table is provided with a wafer correction groove and provides a standard plane for the identification aligner, the top plane correction table and the plane detector, and when being arranged on the correction table, the top plane correction platform also provides a standard plane for the wafer adapter. The verification andrepair method is used to repair the wafer adapter and verifies whether the repaired wafer adapter reaches the standard.

Description

technical field [0001] The invention belongs to the technical field of precision repair operations, and in particular relates to a wafer adapter verification and repair tool and a verification and repair method thereof. Background technique [0002] Chip packaging DTR equipment (Die To Reel) is a device that takes individual chips out of the wafer and packs them into small rolls during the wafer pretreatment process. Wafer adapters are mechanical components used by chip packaging DTR equipment to carry chips. The function of the round adapter is to stick the wafer with a film, and then let the manipulator grab the chip. If there is a problem with the adapter and the film is not fixed, the chip will fall or the manipulator cannot pick it up. The adapter is not just a circular mechanical part, it has a mechanism for fixing the film and a combination of moving parts, as well as a mechanism for adjusting the depth, and also has a flatness detection point for testing the flatness...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68363
Inventor 储飞吴强胡波董波
Owner INTEL PROD CHENGDU CO LTD
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