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Semiconductor optical module and carrier

A semiconductor and optical module technology, applied in the direction of semiconductor lasers, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as changes in the characteristics of semiconductor optical devices, and achieve the effect of suppressing changes in characteristics

Active Publication Date: 2022-03-15
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the deformation of the semiconductor chip is too large, there is a problem that the characteristics of the semiconductor optical device formed on the semiconductor chip will change.

Method used

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  • Semiconductor optical module and carrier
  • Semiconductor optical module and carrier
  • Semiconductor optical module and carrier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] figure 1 It is a perspective view showing the state in which the semiconductor chip 3 is mounted on the carrier 1 which concerns on embodiment of this invention. figure 2 It is a plan view of the carrier 1 according to the embodiment of the present invention, image 3 is vector 1 along the figure 2 A cross-sectional view of line A-A' in, Figure 4 is vector 1 along the figure 2 The cross-sectional view of the line B-B' in.

[0056] exist figure 1 The middle figure shows the stacked structure of the carrier 4 , the carrier 1 and the semiconductor chip 3 . use Image 6 , Figure 7 , Figure 9 and Figure 10 The semiconductor optical modules 10, 110, and 210 described later have the same figure 1 Same stack structure. Alternatively, just use Figure 8 For the semiconductor optical module 50 described later, the support body 4 is not provided, and the carrier 1 is directly fixed to the stem 20 (refer to Figure 8 ). As described above, the carrier 1 is inco...

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Abstract

The invention provides a semiconductor optical module and a carrier, which can suppress the characteristic change of the semiconductor chip on the carrier caused by the welding of the carrier to the base. The carrier (1) has: an upper surface (1a), which is used to mount a semiconductor chip (3); a lower surface (1b), which is located on the opposite side of the upper surface (1a); and an annular side peripheral surface (1c), It connects the upper surface (1a) and the lower surface (1b). A groove (2) extending in the circumferential direction of the side peripheral surface (1c) is provided on the side peripheral surface (1c). As an example, the cross-sectional shape of the groove (2) is rectangular. A plurality of grooves (2) are provided on the side peripheral surface (1c). That is, the groove (2) includes: a first groove (2) extending over the entire circumference of the side peripheral surface (1c); and a second groove (2) extending along the entire circumference of the side peripheral surface (1c) with the The slots (2) run parallel. The groove (2) extends continuously over the entire circumference of the side peripheral surface (1c).

Description

technical field [0001] The invention relates to a semiconductor optical module and a carrier. Background technique [0002] Conventionally, for example, as disclosed in International Publication No. 2013-118478 , there is known a semiconductor device including a substrate with a conductive pattern, and grooves are provided on the side of the conductive pattern of the substrate. The semiconductor device in this publication is a device for electric power, and is used as a power conversion device such as an inverter or a converter. A semiconductor chip is mounted on a substrate with a conductive pattern, and the semiconductor chip is further packaged with a molding resin. By providing the groove on the side surface of the conductive pattern, an anchor effect can be exhibited, and peeling of the molding resin can be prevented. [0003] Patent Document 1: International Publication No. 2013-118478 [0004] The semiconductor optical module includes a component called a submount....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64H01L23/00H01S5/02315H01S5/024
CPCH01L23/562H01L33/483H01L33/642H01S5/02461H01S5/023H01S5/0233H01S5/0235H01L2224/48465H01L2224/48137
Inventor 东祐介增山祐士
Owner MITSUBISHI ELECTRIC CORP
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