X-ray wafer detection equipment

Abstract

The invention discloses X-ray wafer detection equipment. The X-ray wafer detection equipment comprises a control box and a detection box, wherein a plurality of rolling wheels are arranged at the lower ends of the control box and the detection box respectively, a scanner is arranged on the left side of the upper end of the control box, a keyboard is arranged in the middle of the upper end of the control box, a mouse is arranged on the right side of the upper end of the control box, an emergency button, a control switch and a main switch are sequentially arranged on a panel on the front side ofthe control box from top to bottom, and a display screen is arranged in the middle of the front side of the detection box. The X-ray wafer detection equipment is reasonable in structural design and convenient to operate when being used, can automatically identify products, can feed back a detection result in real time, and has a very high practical value; the rolling wheels can facilitate movement of the equipment, both time and labor are saved, and transferring of the equipment is convenient; when the light is a little dark, a lamp tube can illuminate, and thus a detection result is not affected. The X-ray detection device can move up and down and left and right on an X-axis guide rail and a Y-axis guide rail, and no detection blind area exists.

Description

technical field [0001] The invention relates to a detection device, in particular to an X-ray wafer detection device. Background technique [0002] Wafer is the carrier used in the production of integrated circuits, mostly referring to single crystal silicon wafers. Single crystal silicon wafers are drawn and refined from ordinary silica sand, and are made into single crystal silicon rods through a series of measures of dissolution, purification and distillation. After the single crystal silicon rods are polished and sliced, they become wafers. Wafers are the most commonly used semiconductor materials. The larger the wafer, the more ICs can be produced on the same wafer, which can reduce costs; but requires higher material technology and production technology. [0003] Due to the small size of the wafer, special testing equipment is required to determine whether the product after production is qualified. At present, X-ray testing is a relatively common method. However, the...

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Problems solved by technology

[0003] Due to the small size of the wafer, special testing equipment is required to determine whether the product after production is qualified. At present, X-ray testing is a relatively common method. However, the current testing equipment cannot automatically identify the product; sometimes it affects the testing results when the light is dark Large; there is a blind spot in the detection device

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