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Multiple substrate and method for its fabrication

A substrate, brittle fracture technology, used in printed circuit manufacturing, semiconductor/solid-state device manufacturing, printed circuits, etc., can solve the problems of burrs, difficulty in removing corners, time-consuming, etc., and achieve the effect of shortening the length

Active Publication Date: 2018-08-21
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In that case, the fracture edge no longer occurs only along the straight and long intended fracture line, but "burrs" appear, especially in the corner areas (hereinafter also referred to as uncontrolled fracture), which makes subsequent Removing corners is very difficult and time consuming, because for example if they fall below a certain size, they can no longer be removed manually

Method used

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  • Multiple substrate and method for its fabrication
  • Multiple substrate and method for its fabrication
  • Multiple substrate and method for its fabrication

Examples

Experimental program
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Embodiment Construction

[0041] figure 1 A plan view of a first exemplary embodiment of a substantially rectangular complex substrate 1 according to the invention is shown. The complex substrate 1 comprises a brittle fracture plate such as a ceramic or glass plate or a brittle fracture layer 2 such as a ceramic or glass layer, which in the example shown forms a total of nine individual substrates 3 integrally adjoining each other, wherein adjacent The individual substrates 3 adjoin each other via predetermined fracture lines 4 arranged in the brittle fracture layer 2 . A total of four predetermined break lines4 are embedded in the figure 1 The complex substrate 1 is shown. The intended breaking line 4 is shown as a dashed line. In the illustrated embodiment of the composite substrate 1, all predetermined fracture lines 4 are straight, wherein, figure 1 Two of the predetermined breaking lines 4 extend horizontally and parallel to each other, while the other two predetermined breaking lines 4 extend...

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Abstract

The invention relates to a multiple substrate (1, 11, 14, 18) with a brittle-fracture plate or a brittle-fracture layer (2) forming at least two single substrates (3, 12, 15, 19) integrally adjoiningeach other, which are adjoining each other by at least one predetermined fractural line (4) provided in the brittle-fracture layer (2). Bordering the predetermined fracture line (4), at least one aperture (9, 13, 16, 20) is inserted in the brittle-fracture layer (2), which it completely perforates, and which aperture materially separates the single substrates (3, 12, 15, 19) which are adjoining each other via the predetermined fracture line (4). The invention also relates to a method for fabricating such a multiple substrate (1, 11, 14, 18).

Description

technical field [0001] The invention relates to a complex substrate and a method for producing the complex substrate. Background technique [0002] It is known to produce substrates, in particular substrates with ceramic insulating or carrier layers, such as alumina ceramics or aluminum nitride ceramics, in many applications, which means multiple substrates on a common insulating and carrier layer as complex substrates. separate application or single substrate and, where appropriate, also equips it with an electronic circuit board, whereby the multiple substrates are separated or singulated. In the case of multiple substrates with a ceramic insulating or carrier layer, this singulation is in particular by cutting along cutting lines delimiting the individual substrates, in particular by means of laser cutting and / or by cutting along cutting lines or predetermined breaking lines break to complete. [0003] Such complex substrates are described, for example, in DE19504378A1 ...

Claims

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Application Information

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IPC IPC(8): H01L23/15H01L21/48
CPCH01L21/4807H01L23/15H05K1/0306H05K3/0029H05K3/0052H05K3/0097H05K2201/09027H05K2201/09036H05K2201/09063H05K2201/0909H05K2203/302H01L23/13H01L21/4803
Inventor A·罗特
Owner INFINEON TECH AG