Pressure control device used for die bonder, and sorting mechanism pressure control rotating system

Abstract

The invention relates to the technical field of sorting machine pressure control, and provides a pressure control device. The device comprises a floating plate and a fixing plate which are arranged onthe upper part and the lower part and are connected through an elastic piece. A voice coil motor and a supporting piece fixedly connected with the fixing plate are arranged between the floating plateand the fixing plate. A stator of the voice coil motor is fixedly connected with the fixing plate. A mover is connected with the floating plate in a contact manner. Height of the supporting piece isbetween the maximum stroke and the minimum stroke of the voice coil motor. The floating plate is also fixedly connected with a contact device. The invention also provides a sorting mechanism pressurecontrol rotating system used for a die bonder, the system having the pressure control device. Thus, the device provides pressure through using a pre-stretched elastic piece, and a force in an oppositedirection is provided by using the voice coil motor. Variation of output forces is controlled through controlling current of the voice coil motor, rational total pressure applied on an electrical element is obtained, and the electrical element is prevented from being damaged by pressing.

Description

technical field [0001] The invention relates to the technical field of pressure control of a sorting machine, in particular to a pressure control device for a chip welding machine and a pressure control rotating system of a sorting mechanism. Background technique [0002] In the production process of the electronics industry, NG products and OK products need to be placed separately after product inspection by vision or sensors. It is necessary to pick up, transport and locate small-sized and large-quantity electrical components; therefore, the overall pick-and-place structure requires that the electronic components can be stably adsorbed, and there should not be too much pressure attached to the electronic components during the suction process, so as not to cause damage to the electronic components , scratches, etc. [0003] At present, sorting machines are usually used to complete this work. The existing picking method can stably absorb electrical components, but the force...

AI Technical Summary

Problems solved by technology

[0003] At present, sorting machines are usually used to complete this work. The existing picking method can stably absorb electrical components, but the force attached to the electrical components cannot be well controlled during the suction process, which can easily cause damage to the electrical components. A reasonable suction system is needed, on the one hand, it can absorb electrical components well, and on the other hand, it needs to control the force attached to the electrical components during the adsorption process.

[0004] In summary, there are obviously inconveniences and defects in the actual use of the existing technology, so it is necessary to improve

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