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Display panel and display terminal

A technology for display panels and display areas, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as reduced packaging reliability and easy cracking of thin-film packaging layers

Active Publication Date: 2021-04-23
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventors found in actual production that the thin film encapsulation layer corresponding to the binding area is easy to crack, thus forming a channel for water and oxygen to penetrate, thereby reducing the reliability of the encapsulation

Method used

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  • Display panel and display terminal
  • Display panel and display terminal

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Embodiment Construction

[0017] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0018] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as...

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Abstract

The invention discloses a display panel and a display terminal. This includes a binding area, the binding area includes a planarization layer and a thin film encapsulation layer that are arranged in direct contact with each other in sequence, and the thin film encapsulation layer covers the planarization layer. In the present invention, a planarization layer is arranged first in the binding area, and then a thin film encapsulation layer is arranged, and the inorganic encapsulation layer in the formed thin film encapsulation layer is flat, and the stress of the inorganic encapsulation layer can be buffered by using the planarization layer, thereby improving the flexibility of the display panel. The circuit in the bonding area will not be damaged, effectively avoiding the problem that the thin film encapsulation layer corresponding to the bonding area provided with multilayer wiring is easy to crack, thereby improving the reliability of the packaging and further increasing the service life of the display panel.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel and a display terminal. Background technique [0002] In the field of display technology, the organic luminescent material of the display panel is very sensitive to oxygen and water vapor, so it is necessary to provide a high-reliability thin film encapsulation layer to avoid failure caused by water and oxygen intrusion. On the IC (integrated circuit, integrated circuit) bonding position of the display panel, multi-layer wiring needs to be arranged, such as data lines, power lines, etc., and then film packaging is also performed on the bonding area. The inventors found in actual production that the thin-film encapsulation layer corresponding to the bonding area is prone to cracking, thereby forming channels for water and oxygen to penetrate, thereby reducing the reliability of the encapsulation. Contents of the invention [0003] Based on this, it is n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52
CPCH10K50/844
Inventor 黄莹李雪原朱平刘胜芳
Owner YUNGU GUAN TECH CO LTD