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Broadband multilayer microstrip Butler beamforming network matrix device

A beamforming and network matrix technology, applied in connecting devices, waveguide devices, electrical components, etc., can solve the problems of poor port amplitude flatness, narrow matrix operating frequency, large port phase shift error, etc., and achieve small port amplitude fluctuations. , The effect of high port phase shift accuracy and wide operating frequency

Active Publication Date: 2018-08-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

[0004] The present invention solves the defects of current existing Butler matrix such as narrow operating frequency, large port phase shift error, poor port amplitude flatness, etc., and the realized broadband multi-layer microstrip Butler beamforming network matrix is ​​easy to manufacture, low cost, and port phase shifts The advantages of high precision, small port amplitude fluctuation, low loss, wide operating frequency, and high port isolation can meet the requirements of modern civil mobile communication systems and military radar systems for the new generation of multi-beam array antennas and antenna testing.

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  • Broadband multilayer microstrip Butler beamforming network matrix device
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  • Broadband multilayer microstrip Butler beamforming network matrix device

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Embodiment Construction

[0031] The present invention is a kind of broadband multi-circuit substrate layer microstrip Butler matrix based on multi-layer printed board technology, which is characterized in that it includes a first dielectric layer, a circuit substrate and a second dielectric layer, and the circuit is etched on the upper and lower surfaces of the circuit substrate. On the metal layer, a wide-side tightly coupled circuit is formed to form a strong coupling for broadband applications. There are metallized vias on the circuit substrate to connect the upper and lower circuits; the microstrip Butler matrix is ​​a 4×4 matrix consisting of 4 feed ports , 4 antenna ports, 1 90°3dB wideband tightly coupled directional coupler and 3 180°3dB wideband tightly coupled directional couplers. The feed ports C and D of the first 90° 3dB broadband tightly coupled directional coupler are respectively the 1 and 2 input ports of the device of the present invention, and the △ and ∑ feed ports of the third 180...

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Abstract

The invention discloses a broadband multilayer microstrip Butler beamforming network matrix device, and belongs to the technical field of electronic communication in order to solve the defects, such as a narrow operating frequency, a large port phase shift error, and poor port amplitude flatness, of a current Butler matrix. The broadband multilayer microstrip Butler beamforming network matrix device is easy to manufacture, low in cost, high in port phase shift accuracy, small in port amplitude fluctuation, low in loss, wide in operating frequency and high in port isolation degree, can meet therequirements of modern civilian mobile communication systems and military radar systems for new-generation multi-beam array antennas and antenna testing.

Description

technical field [0001] The invention belongs to the technical field of electronic communication. Background technique [0002] With the rapid development of communication technology, the relatively simple implementation and accurate pointing of multi-beam antennas make it play an increasingly important role in radar and communication systems, especially 4G and 5G mobile communication systems. The core of the multi-beam antenna lies in the feed network of the beam forming circuit, and the Butler matrix has great application prospects due to its simple structure, low insertion loss, and easy fabrication. [0003] At present, the existing Butler matrix technology is mainly composed of multiple single-layer microstrip couplers and transmission microstrip line phase shifters to change the amplitude and phase of each output port signal, and after feeding into the phased array antenna, beamforming is realized. And the signal processing function of power spectrum estimation to dete...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/18
CPCH01P5/18
Inventor 宁俊松王占平补世荣曾成陈柳
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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