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An optical waveguide component

A technology of optical waveguide and components, which is applied in the field of optical communication, and can solve problems such as the difficulty of connecting embedded optical waveguides and optical fibers

Active Publication Date: 2021-07-06
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] An embodiment of the present invention provides an optical waveguide assembly to solve the problem that the connection between an embedded optical waveguide and an optical fiber is relatively difficult

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  • An optical waveguide component
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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0014] refer to Figure 1 to Figure 3 , the present invention provides an optical waveguide assembly, the optical waveguide assembly includes an optical waveguide printed board 11, a first assembly part 12 and a second assembly part 13, wherein,

[0015] The optical waveguide printed board 11 includes a substrate layer 111 and an optical waveguide transmission layer 112 embedded in the substrate layer 111, one end of the optical waveguide transmission ...

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Abstract

The present invention provides an optical waveguide assembly, including an optical waveguide printed board, a first assembly part and a second assembly part, wherein the optical waveguide printed board includes a substrate layer and an optical waveguide transmission layer embedded in the substrate layer, and the optical waveguide One end of the transmission layer extends outward from the substrate layer and is fixedly connected to the first assembly part; the first surface of the second assembly part is recessed inwardly to form a first receiving groove for accommodating the first assembly part; inside the first receiving groove An elastic component is provided, and the elastic component is used to elastically resist the first assembly component, so that when the first assembly component is bonded to the optical fiber component, the end face of the optical waveguide transmission layer is bonded to the fiber end face of the optical fiber component. Since the elastic member is set to elastically abut against the first assembly part, when the first assembly part is attached to the optical fiber part, the end face of the optical waveguide transmission layer is closely attached to the end face of the optical fiber part of the optical fiber part, thus reducing the contact between the embedded optical waveguide and the optical fiber part. Difficulty connecting optical fibers.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical waveguide component. Background technique [0002] At present, the increasing demand for high interconnect bandwidth in the field of communication systems has prompted the continuous development of optical interconnect technologies. With the continuous improvement of data traffic, the data processing capacity of equipment is increasing, and the single-line rate is continuously increasing. With the decrease of the cost of optical interconnection, optical interconnection has gradually developed from rack-to-rack interconnection to single-board-to-single-board interconnection structure, and even applied to chip-to-chip interconnection. [0003] In recent years, the interconnection technology of embedded waveguide PCB (embedded waveguide PCB) based on the theory of optical waveguide has gradually developed and has been extensively studied at home and abroad....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/38
CPCG02B6/3838G02B6/3873
Inventor 陈勋
Owner ZTE CORP