A semiconductor diode lead wire sealing system

Abstract

The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode lead-wire sealing system. The semiconductor diode lead-wire sealing system comprises a bottom plate, a vertical column, a top plate, a sealing groove, a drying module, a storing block and storing holes; a set of telescopic rods are arranged at the bottom of the top plate; the storing block is fixedly connected with the ends of the telescopic rods, and the set of storing holes are formed in the bottom of the storing block; the drying module comprises an arc-shaped sliding groove, an electric heating pipe, swinging gears and a swinging plate; the arc-shaped sliding groove is mounted in the middle of the vertical column; the electric heating pipe is slidably mounted in the arc-shaped sliding groove; a spring connected with the electric heating pipe is arranged at one end of the arc-shaped sliding groove; the swinging gears are rotatably mounted at the two endsof the electric heating pipe through torsion springs; the swinging plate rotatably mounted on the vertical column is arranged above the arc-shaped sliding groove; gear sockets meshed with the swinginggears are arranged at the ends of the swinging plate; and the swinging plate is controlled to rotate through a motor. The semiconductor diode lead-wire sealing system can conduct uniform drying on the sealed lead-wire; and by arranging a clamping device, the system can adapt to sealing of lead-wires with different thickness.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode production, in particular to a semiconductor diode lead wire sealing system. Background technique [0002] The leads of the diode need to be sealed with glue so that they can be prepared into a complete diode. In the existing sealing process, the lead wires are often repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue liquid above the sealing teeth realizes gluing treatment on the leads. However, in the above-mentioned sealing process, the lead wire will also rub against the sealing teeth while applying the glue, so that the lead wire may be bent; at the same time, it is difficult to ensure the uniformity of the glue distribution on the sealing teeth , It is also difficult to control the gluing uniformity of the lead. [0003] There are also some technical solutions for sealing diode leads in the prior art. For example, a Chinese patent with appl...

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Problems solved by technology

[0004] This technical solution can seal the lead wire of the secondary tube, but only install a heating tube on one side when drying the glue after the sealing is completed, which makes the drying efficiency low, and this solution cannot be applied to different Thick and thin lead sealing glue makes it less versatile

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