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ict

A tester and testing mechanism technology, applied in the field of ICT testers, can solve the problems of reverse insertion, single function of the top plate test, and inability to check whether the electrical components can be checked at the same time, so as to increase the detection efficiency and improve the detection ability.

Pending Publication Date: 2018-08-31
GREE ELECTRIC APPLIANCES ZHENGZHOU +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is that the top plate test function of the ICT tester in the prior art is single, lacks a comprehensive inspection of the electrical components located on the component surface of the circuit board, and cannot simultaneously check different components located on the component surface of the circuit board. Whether the electrical components are inserted in reverse

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0049] This embodiment provides an ICT tester, such as figure 1 shown, the ICT tester includes

[0050] The top plate 1 is driven by the cylinder to move towards the component surface of the circuit board 2;

[0051] Electrical component pin testing agencies3 such as Image 6 As shown, it is arranged on the top plate 1, which includes the second probe 6 corresponding to the pin 5 of the electrical component 4 arranged on the component surface, and the second probe 6 is controlled by the The top plate 1 is driven and connected to the pin 5, and the top plate 1 is lowered during use. The second probe 6 is connected to the pin 5 on the surface of the component. It is judged by electrical signals that the pin 5 is located on the component. Whether the electrical components 4 on the surface can be used normally; solves the problem that it is impossible to test whether the electrical components are in normal use when the test points on the pin surface of the circuit board are blo...

Embodiment 2

[0060]The difference between this embodiment and Embodiment 1 is that the first conductive member 16 and the second conductive member 17 are cylindrical structures, and a protective sleeve is sleeved on the side of the two away from each other, and the spring sleeve Placed on the outside of the columnar body and the two ends of the spring are fixedly connected to the ends of the protective sleeves sleeved on the first conductive member 16 and the second conductive member 17 respectively, and are respectively arranged on the first conductive member 16 and the second conductive member 17. 16 and the two protective sheaths on the second conductive member 17 are also provided with an outer protective sheath for covering the connecting part of the first conductive member 16 and the second conductive member 17 . The above-mentioned protective cover and outer protective cover are used to prevent other parts from touching the connection position of the first conductive member and the s...

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Abstract

The invention discloses an ICT. The ICT comprises a floor, an electrical element pin testing mechanism, an electrolytic capacitor reverse plugging testing mechanism and a needle base reverse pluggingtesting mechanism, wherein the floor is driven to move towards an element side of a circuit board, the electrical element pin testing mechanism is arranged on the floor and used for testing whether ornot electrical elements, located on the element side, of pins can be normally used, the electrolytic capacitor reverse plugging testing mechanism is arranged on the floor and used for testing whetheror not an electrolytic capacitor on the element side is plugged reversely, and the needle base reverse plugging testing mechanism is arranged on the floor and used for testing whether or not a to-be-tested needle base on the element side is plugged reversely. By arranging the electrical element pin testing mechanism, the electrolytic capacitor reverse plugging testing mechanism and the needle base reverse plugging testing mechanism on the floor simultaneously, the technical problems in the prior art are solved that a floor testing function of an ICT is monotonous, comprehensive checking on electrical elements on the element side of the circuit board is lacked, and whether or not different electrical elements located on the element side of the circuit board are plugged reversely cannot bechecked simultaneously.

Description

technical field [0001] The invention relates to the technical field of test fixtures, in particular to an ICT tester for testing circuit boards. Background technique [0002] With the continuous development of electronic technology, electronic products are constantly enriching our lives, and the circuit board, as the most important part, is related to the performance and quality of the product itself. In order to ensure the quality of the circuit board, an ICT tester is needed to test the circuit board. ICT is a high-precision electronic component performance testing equipment. Its principle is equivalent to a large multimeter. To collect electrical parameters, and then through software processing, to achieve controllable fault testing. The existing ICT tester mainly detects the lead surface of the circuit board through the probes arranged on the needle board, lacks the detection for the component surface of the circuit board, and the test function of the ICT tester is sing...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2808
Inventor 郭松山解伟赵冰清李文涛顾岳峰李振宇
Owner GREE ELECTRIC APPLIANCES ZHENGZHOU
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