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Epoxy resin composition

A technology of epoxy resin and composition, which is applied in the direction of epoxy resin glue, epoxy resin coating, polishing composition, etc. It can solve the problems that it is difficult to simultaneously achieve excellent weather resistance of cured coating film, excellent adhesion of polycarbonate resin, etc. , to achieve the effect of excellent adhesion

Inactive Publication Date: 2018-08-31
NEW JAPAN CHEM CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the use of additives improves initial adhesion, it is difficult to achieve both excellent weather resistance (change in appearance) of the cured coating film and its excellent adhesion to polycarbonate resin over a long period of time

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

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specific example

[0316] Specific examples include cyclohexanedicarboxylate anion, 3-methylcyclohexanedicarboxylate anion and 4-methylcyclohexanedicarboxylate anion.

[0317] Contain the organic anion (Z of the structure represented by formula (5) - ) Examples include organic sulfonic acid anions represented by formula (12)

[0318] R 28 -SO 3 - (12)

[0319] where R 28 means C 1-18 alkyl.

[0320] In formula (12) by R 28 represented by C 1-18 Alkyl is preferably straight chain or branched C 1-18 Alkyl, more preferably linear or branched C 1-12 alkyl. These alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl, tert-amyl, Neopentyl, n-hexyl, isohexyl, sec-hexyl, tert-hexyl, neohexyl, n-heptyl, n-octyl, 2-ethylhexyl, n-nonyl, isononyl, n-decyl, isodecyl and n-decyl dialkyl. Among them, methyl is preferred.

[0321] Specific examples of the organic sulfonic acid anion represented by formula (12) include m...

Embodiment

[0386] Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these Examples. The properties described in Examples and Comparative Examples were each measured according to the following methods. For compounds not specified here, reagents are used. The compounds used in Production Examples 1 to 3, Examples 1 to 25, and Comparative Examples 1 to 19, their abbreviated names, and substrates are shown below.

[0387] Compound Abbreviation, Compound and Substrate Used

[0388] Anhydride

[0389] -HH: Rikacid HH, hexahydrophthalic anhydride (manufactured by Nippon Rika Co., Ltd.)

[0390] -MH-T: Rikacid MH-T, 4-methylhexahydrophthalic anhydride (manufactured by Nippon Rika Co., Ltd.)

[0391] alcohol

[0392] -HB: Rikabinol HB, hydrogenated bisphenol A (manufactured by Nippon Rika Co., Ltd.)

[0393] -27-DH: Decahydro-2,7-naphthalenediol (manufactured by Sugai Chemical Industry Co.,...

manufacture example 1

[0479] To a solution of 17.6 g of HB (73.0 mmol) in 15.0 g of butyl acetate, 22.5 g of HH (146.0 mmol, which is twice the amount of HB in mmol) was added, and the resulting product was incubated under a stream of nitrogen Stirring was carried out at 110° C. for 3 hours, thereby obtaining a solution of the dicarboxylic acid compound (HB / HH) in butyl acetate. To this dicarboxylic acid compound solution, 26.1 g of acetic anhydride (255.5 mmol, which is 3.5 times that of HB in terms of mmol) was added, and stirred at 100° C. for 1 hour under a nitrogen stream. Subsequently, the pressure inside the reactor was gradually reduced to 10.7kPa˜13.3kPa, and the solvent was added dropwise into the reactor and distilled off (butyl acetate was dropped and distilled off at a rate of 60 mL / hour) to allow the reaction to proceed for 5 hour, thereby obtaining polycarboxylic acid anhydride solution. Thereafter, the solution was diluted to 40% by weight with butyl acetate, and a solution of poly...

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Abstract

The purpose of this invention is to provide an epoxy resin composition with which it is possible to form a cured epoxy resin having excellent initial transparency and weather resistance as well as excellent adhesion to various substrates. This invention pertains to an epoxy resin composition containing (A) an epoxy resin, (B) a polycarboxylic anhydride including a structural unit represented by general formula (1), and (C) a specific phosphonium compound. (In the formula, A represents a cycloalkylene group or the like, R1-R10 are the same or different and each represent a hydrogen atom or an optionally substituted C1-10 alkyl group, and two of the R1-R10 groups may bond together to form a divalent group.)

Description

technical field [0001] This invention relates to epoxy resin compositions. Background technique [0002] Cured epoxy resin products obtained by curing epoxy resin compositions have excellent heat resistance, adhesion to substrates, chemical resistance, water resistance, mechanical strength, electrical properties, etc.; therefore, these cured epoxy resin products It has a wide range of applications in the fields of coating compositions, civil engineering, bonding and electricity. [0003] Recent developments in portable electronic devices, including cell phones, digital cameras, and notebook computers, reflect electronic components such as semiconductor devices (transistors, field-effect transistors (FETs), thyristors (SCRs), diodes (rectifiers)) and optical semiconductors (such as optocouplers). , light-emitting diodes (LEDs) and photo-interrupters) are becoming smaller and thinner with their higher density and higher integration. For semiconductor packages containing comb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C09D7/63C09D163/00C09J11/06C09J163/00H01L23/29H01L23/31
CPCC09D163/00C09J163/00C08G59/24C08G59/245C08G59/3218C08G59/4215C08G59/688H01L23/293C08G59/3245C09D7/40C08G59/42C08K5/50C09G1/10C09J11/06H01L23/29H01L23/31C08J5/18C08K5/09C08K5/55
Inventor 永岛田贵之原田依里子
Owner NEW JAPAN CHEM CO
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