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Method for preparing micro angle driving device

A driving device, micro-angle technology, applied in the direction of generator/motor, piezoelectric effect/electrostrictive or magnetostrictive motor, electrical components, etc., can solve the problems of improving driving efficiency and displacement range, and reduce the Effects of deformation and stress, improving device reliability, avoiding cracks

Active Publication Date: 2018-09-04
常州春杰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a preparation method of a micro-angle driving device in order to solve the above problems, to solve the problem of using a rectangular piezoelectric device in the prior art and realizing displacement driving through the expansion and contraction of the piezoelectric device, but its driving efficiency and The problem that the displacement range needs to be improved

Method used

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  • Method for preparing micro angle driving device
  • Method for preparing micro angle driving device
  • Method for preparing micro angle driving device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Step (1), such as figure 1 As shown, a substrate 1 is provided, and an opening is formed on the substrate 1;

[0036] Step (2), such as figure 2 As shown, a double-throwing silicon dioxide silicon wafer 2 is provided, and the double-throwing silicon dioxide silicon wafer 2 is fixed above the opening;

[0037] Step (3), such as image 3 As shown, an adhesive layer, a lower electrode, a piezoelectric layer, and a Ti / Pt upper electrode are sequentially prepared on the double-polished silicon dioxide wafer, and after patterning, a piezoelectric unit 41 and a piezoelectric unit 42 with a special-shaped structure are formed. . Piezoelectric unit 43 and piezoelectric unit 44, the special-shaped structure is a strip structure with a width at both ends greater than a width in the middle;

[0038] Step (4), using the piezoelectric unit and the mask to pattern the double-thrown dioxygen silicon wafer to form a central area 6 and two sets of support arms, and the central area ...

Embodiment 2

[0041] The preparation process of embodiment 2 is basically the same as embodiment 1, the difference is as Figure 6 As shown in the formation of steps (3) and (4), each group of support arms has two connecting arms, and the connecting arms are arranged in a meandering continuous structure, and the adjacent connecting arms are connected by joints 5, and the distance between the connecting arms is is 2.5 microns, and the width in the middle of the connecting arm is 1.8 microns. The piezoelectric unit conformally arranged with the connecting arm is the piezoelectric unit 91 and the piezoelectric unit 92 on the upper support arm, and the piezoelectric unit 93 and the piezoelectric unit 94 on the lower support arm, wherein the piezoelectric unit 91 and the piezoelectric unit The electrical unit 92 is deformed in opposite directions, the piezoelectric unit 93 and the piezoelectric unit 94 are deformed in opposite directions, and at the same time, the deformation directions of the u...

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Abstract

The invention discloses a method for preparing a micro angle driving device. The device comprises a substrate with an opening structure, a double-polishing double-oxygen wafer with a suspended structure, a bonding layer, a lower electrode, a piezoelectric layer, a Ti / Pt upper electrode stack layer are formed above the opening, and a special-shaped structure is formed through patterning. In the prior art, a rectangular piezoelectric device is generally used in the prior art, the displacement driving is realized by the expansion and contraction of the piezoelectric device, but the driving efficiency and the displacement range need to be improved, for the above problem, the present invention provides the method for preparing the micro angle driving device, and high driving efficiency and a large displacement range are achieved.

Description

technical field [0001] The invention relates to the field of driving devices, in particular to a preparation method of a micro-angle driving device. Background technique [0002] Micromechanical technology has become a hot technology in the field of modern science and technology, and it is also a key technology in nanotechnology research. In order to obtain the precise driving of micro-displacement, the piezoelectric actuator has gradually entered people's field of vision, and has received extensive attention due to its advantages of high control precision and fast response. The basic principle of piezoelectric drive technology is based on the inverse piezoelectric effect of piezoelectric ceramic materials, which can generate rotation or linear motion by controlling its mechanical deformation. It has the advantages of simple structure, low speed and high torque. There are 3 types of this motor, ultrasonic, peristaltic and inertial. The ultrasonic type is based on the use ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02N2/00
CPCH02N2/22
Inventor 郭玉华
Owner 常州春杰电子科技有限公司