A debonding device and control method
A control method and debonding technology, which is applied in the field of debonding, can solve problems such as bonded sheet fragments, achieve stable operation, and improve product yield.
Active Publication Date: 2020-05-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
[0005] The present invention provides a debonding device and a control method to solve the problem of bonded sheet fragments existing in the prior art
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[0034] The present invention is described in detail below in conjunction with accompanying drawing:
[0035] Such as figure 1 As shown, the present invention provides a debonding device, which includes an upper adsorption unit 2 and a lower adsorption unit 3 respectively located on the upper and lower sides of the bonding sheet 1, an adjustment unit 4 connected to the upper adsorption unit 2, and an adjustment unit 4 connected to the lower adsorption unit. The adsorption unit 3 is connected to the operation control unit 5 . Specifically, the bonding sheet 1 includes a glass sheet 11 and a silicon sheet 12 from top to bottom, the glass sheet 11 and the silicon sheet 12 are bonded together by bonding glue, and the debonding device in the present invention is used to Make the glass sheet 11 and the silicon sheet 12 unbonded, even if the two are completely separated, the glass sheet 11 and the silicon sheet 12 are respectively adsorbed by the upper adsorption unit 2 and the lower...
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The invention discloses a de-bonding device and a control method. The de-bonding device comprises an upper adsorption unit, a lower adsorption unit, an adjustment unit and an operation control unit, wherein the upper adsorption unit and the lower adsorption unit are respectively located at the upper side and the lower side of a bonding sheet, the adjustment unit is connected with the upper adsorption unit, and the operation control unit is connected with the lower adsorption unit. The upper adsorption unit and the lower adsorption unit respectively adsorb a glass sheet and a silicon wafer, andthen the operation control unit drives the lower absorption unit to horizontally move respectively in a torque control mode and a speed control mode, so that the silicon wafer is driven to be separated from the glass sheet, the sheets are ensured to operate stably in the de-bonding process through the torque control and the speed control mode, undesirable phenomena such as pressure damages, crackand debris caused by uneven stress of the sheets due to excessively high speed, excessively large torque and the like are avoided, and the product yield is improved.
Description
technical field [0001] The invention relates to the technical field of debonding, in particular to a debonding device and a control method. Background technique [0002] Debonding equipment is an important equipment in the semiconductor process route. The debonding process is to process the bonding sheet composed of glass sheet, intermediate material (such as bonding glue), and silicon wafer through a series of processes (including thinning, TSV processing and metal bonding). chemical, etc.) after the disassembly process. The main problem to be overcome by the conventional thermal slip debonding technology is to prevent the split phenomenon during the thermal slip process. Since wafers in the semiconductor field are usually thin and fragile, especially deformation under stress during heat release after heating. The smooth operation of silicon wafers in the debonding process is an important factor to avoid wafer splitting, and the control method in the process of bonding wa...
Claims
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IPC IPC(8): H01L21/60
CPCH01L24/02H01L24/03
Inventor 卓国海余斌
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD