Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

computer heat sink

A heat dissipation mechanism and computer technology, applied in computing, machines/engines, mechanical equipment, etc., can solve problems such as low heat dissipation efficiency, insufficient air circulation, and difficulty in heat dissipation, and achieve efficient heat dissipation, reasonable structure, and fast heat dissipation

Active Publication Date: 2021-04-13
深圳市博仑帅科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The computer will generate heat during use, if the heat cannot be dissipated well, it will affect the work of the computer
The general computer heat dissipation mechanism is just a simple fan installed under the computer base, the heat dissipation efficiency is relatively low, and the heat production of the computer is not uniform. Insufficient circulation, more difficult to dissipate heat
At the same time, the height of the computer base increases, which affects the use of the computer. Therefore, we propose a computer cooling mechanism

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • computer heat sink
  • computer heat sink
  • computer heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-6 , the present invention provides a technical solution: a computer heat dissipation mechanism, including a mechanism body shell 8, a card slot 1 connected to the side of the mechanism body shell 8, the card slot 1 is stuck on the computer display shell 7, and the card A servo motor driver 21 is fixed on the side of the groove 1, a servo motor 2 is arranged inside the main body shell 8 of the mechanism, and a fan blade 3 is connected on th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a computer heat dissipation mechanism, comprising a mechanism main body casing, a card slot is connected to the side of the mechanism main body casing, the card slot is clamped on a computer display casing, a servo motor driver is fixed on the side of the card slot, and the The shell of the main body of the mechanism is connected with a heat dissipation pipe, the heat dissipation pipe is fixed on the side suction head, the side suction head is provided with a side suction panel, the side suction panel is provided with a suction hole, and the temperature is installed in the suction hole. Sensor, a lower splint is fixed under the side suction panel, an upper splint is fixed above the side suction panel, a slit is arranged on the inner side of the side suction panel, a thin metal frame is connected to the upper splint, and the thin metal There are screw holes on the rack. The main body of the computer heat dissipation mechanism is fixed on the computer monitor shell, the air is circulated, the heat dissipation is faster, the side suction heat dissipation is adopted, and the structure is more reasonable.

Description

technical field [0001] The invention relates to the technical field of computer cooling mechanisms, in particular to a computer cooling mechanism. Background technique [0002] Computers generate heat during use. If the heat cannot be dissipated well, it will affect the work of the computer. The general computer heat dissipation mechanism is just a simple fan installed under the computer base, the heat dissipation efficiency is relatively low, and the heat production of the computer is not uniform. Not enough circulation, heat dissipation is more difficult. At the same time, the height of the computer base increases, which affects the use of the computer. Therefore, we propose a computer cooling mechanism. Contents of the invention [0003] The purpose of the present invention is to provide a computer heat dissipation mechanism to solve the problems raised in the background art above. [0004] In order to achieve the above object, the present invention provides the foll...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20F04D25/08F04D25/16F04D27/00F04D29/00
CPCF04D25/08F04D25/166F04D27/001F04D29/002G06F1/20
Inventor 李佩恒
Owner 深圳市博仑帅科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com