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Force sensor

A sensor and power technology, applied in the field of sensors, can solve the problems of easy wear and tear of sensing elements, increasing the overall thickness of the sensor and manufacturing costs, etc.

Inactive Publication Date: 2018-09-14
CORETRONIC MEMS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the micro-electromechanical force sensor, the sensing element is used to sense the pressing force applied by the entity. If the sensing element is exposed and directly bears the pressing force, the sensing element is easily worn out
If a cover is added to cover the sensing element and withstand the pressing force in order to solve the above problems, the overall thickness and manufacturing cost of the sensor will be increased

Method used

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Embodiment Construction

[0048] figure 1 It is a cross-sectional view of a force sensor according to an embodiment of the present invention. Please refer to figure 1 The force sensor 100 of this embodiment is, for example, a microelectromechanical force sensor and includes a sensing element 110 and a circuit board 120. The sensing element 110 has a top surface 110 a and a bottom surface 110 b opposite to each other, and has a sensing portion 112, and the sensing portion 112 is located on the top surface 110 a. The sensing element 110 may be a piezoresistive sensing element, a capacitive sensing element, or other suitable types of sensing elements, and the present invention is not limited thereto. The circuit board 120 is disposed on the top surface 110a of the sensing element 110 and is electrically connected to the sensing element 110a. The sensing portion 112 of the sensing element 110 is adapted to generate a sensing signal by an external force transmitted from the circuit board 120 to the top surf...

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Abstract

The invention provides a force sensor comprising a sensing element and a circuit board. The sensing element is provided with a top surface and a bottom surface which are opposite and a sensing part, wherein the sensing part is arranged on the top surface. The circuit board is configured on the top surface and electrically connected with the sensing element. The sensing part is suitable for generating sensing signals through the external force transferred to the top surface from the circuit board.

Description

Technical field [0001] The invention relates to a sensor, in particular to a force sensor. Background technique [0002] Micro-Electro-Mechanical System (MEMS) technology is a design based on miniaturized electromechanical integrated structure. At present, common micro-electromechanical technology is mainly used in three fields: Microsensors, Micro actuators, and Micro structures. Among them, micro-sensors can change the external environment (such as power, Pressure, sound, speed, etc.) are converted into electrical signals (such as voltage or current, etc.) to achieve environmental sensing functions, such as force sensing, pressure sensing, sound sensing, acceleration sensing, etc. Since the micro-sensor can be manufactured using semiconductor process technology and can be integrated with integrated circuits, it has better competitiveness. Therefore, microcomputer inductance sensors and sensing devices using microcomputer inductance sensors are actually the development trend o...

Claims

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Application Information

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IPC IPC(8): G01L1/18G01L1/14
CPCG01L1/142G01L1/18
Inventor 童玺文吴名清
Owner CORETRONIC MEMS CORP