A Large Dynamic Frequency Conversion Amplifying Component
A technology of amplifying components and large dynamics. It is applied to electrical components, electrical equipment structural parts, and modification using gaseous coolant. It can solve problems such as lack of good shock absorption devices, inability to guarantee performance, and unfavorable protection of internal components. , to achieve good protection, beneficial to use, and prevent dust adsorption
Active Publication Date: 2020-04-24
南京健波微电子有限公司
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Problems solved by technology
[0002] With the rapid development of wireless communication technology, spectrum resources are becoming more and more tense, and the electromagnetic wave environment is becoming more and more complex. Therefore, it is urgently required that the receiver has stronger anti-interference ability and larger dynamic range. The existing large dynamic frequency conversion When the amplification component is installed, the bottom surface is generally in direct contact with the mounting plate, which is not conducive to heat dissipation, and its performance cannot be guaranteed. At the same time, the interface is easy to fall into dust, etc., and the device does not have a good shock absorption device, which is not conducive to the protection of internal components.
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[0020] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0021] see Figure 1-4 , the present invention provides a technical solution: a large dynamic frequency conversion amplification assembly, including assembly body 1, housing 2, first end cover 3, protruding eaves 4, first fixing bolt 5, output connection block 6, output interface 7 , power line column 8, second fixing bolt 9, input connection block 10, input interface 11, shock absorbing base 12, bending connection block 13, support block 14, rubber pad 15, air inlet and outlet 16, air inlet and outlet holes 17, bolt holes 18 , second end cover 19, temperature sensor 20, third fixing bolt 21, radiator 22, dustproof net 23, cooling fan 24, PLC controller 25, bottom s...
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The invention discloses a variable-frequency amplifying component with a large dynamic range. The amplifying component comprises a component body. The outer side of a first end cover is provided withan eave. The bottom inside a housing is provided with a shock absorbing base. The bottom of the housing is provided with a curve connecting block. The bottom of the curve connecting block is providedwith a supporting block. The bottom of the housing is provided with an inlet and outlet port. The top end inside the housing is provided with a temperature sensor. A radiator is installed on the bottom end of the middle of the second end cover by a third fixing bolt. The bottom of the shock absorbing base is provided with a bottom case filled with shock absorbing foam. Damping spring holes are uniformly disposed inside the shock absorbing foam. Damping springs are installed in the damping spring holes. The variable-frequency amplifying component has high heat dissipation efficiency, can protect wiring port, avoids dust adsorption, has good shock absorption performance, and can protect the internal components of the component, and is beneficial to use.
Description
technical field [0001] The invention relates to a frequency conversion amplification component, in particular to a large dynamic frequency conversion amplification component. Background technique [0002] With the rapid development of wireless communication technology, spectrum resources are becoming more and more tense, and the electromagnetic wave environment is becoming more and more complex. Therefore, it is urgently required that the receiver has stronger anti-interference ability and larger dynamic range. The existing large dynamic frequency conversion When the amplification component is installed, the bottom surface is usually in direct contact with the mounting plate, which is not conducive to heat dissipation, and its performance cannot be guaranteed. At the same time, the interface is easy to fall into dust, etc., and the device does not have a good shock absorption device, which is not conducive to the protection of internal components. [0003] Therefore, how to ...
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IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/1405H05K7/20172H05K7/20209
Inventor 张扬文
Owner 南京健波微电子有限公司