Anti-electromagnetic interference shielding device and manufacturing method thereof
An anti-electromagnetic interference and shielding device technology, applied in the direction of crosstalk/noise/electromagnetic interference reduction (, circuit device, magnetic field/electric field shielding, etc., can solve the problem that the circuit board cannot be fitted, the clamping unit is easy to loosen, and the production cost cannot be Reduction and other problems, to achieve the effect of saving production costs and better anti-electromagnetic interference
Active Publication Date: 2019-08-16
KINSUS INTERCONNECT TECH
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Problems solved by technology
[0006] In view of the disadvantages of existing shielding devices that cannot be reduced in cost, cannot be completely bonded to the surface of a circuit board, and are easily loosened by clamping units, the present invention provides an anti-electromagnetic interference shielding device and a manufacturing method thereof. Reduce production costs, and can be firmly attached to the surface of the circuit board to avoid leakage of electromagnetic waves
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[0050] The technical means adopted by the present invention to achieve the intended purpose are further described below in conjunction with the drawings and preferred embodiments of the present invention.
[0051] see figure 1 As shown, the present invention is an anti-electromagnetic interference shielding device 10, the first preferred embodiment of the anti-electromagnetic interference shielding device 10 includes a first substrate 11, at least one second substrate 12, a conductive paste 13, A shielding layer 14 , an antirust layer 15 and a protective layer 16 .
[0052] The first substrate 11 includes a first shielding layer 111, an ink layer 112, a first surface 113 and a second surface 114 opposite to each other, and surrounds the first surface 113 and the second surface 114 and is connected to the second surface 114. The first surface 113 and the second surface 114 are perpendicular to a side wall 115 .
[0053] The first shielding layer 111 covers the first surface ...
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The invention provides an anti-electromagnetic interference shielding device and a manufacturing method thereof. The shielding device comprises a first substrate and a second substrate. A first shielding layer is formed on the surface of the first substrate and at least one first through hole is formed in the surface of the first substrate. The second substrate is arranged at the opening of the atleast one first through hole. A second shielding layer is formed on the surface of the second substrate. Conductive paste is arranged between the first substrate and the second substrate so that thefirst substrate and the second substrate are electrically connected with the first shielding layer and the second shielding layer. A shielding layer, an anti-rust layer and a protection layer are formed on the conductive paste. According to the invention, when the shielding device is arranged on a circuit board, the shielding device can be directly welded to a welding pad of the circuit board through surface welding, thus, the shielding device can be stably and fixedly connected with the circuit board; and there is no gap between surfaces of the circuit board, so a quite good anti-electromagnetic interference function is provided.
Description
technical field [0001] The invention relates to a shielding device, in particular to a shielding device against electromagnetic interference and a manufacturing method thereof. Background technique [0002] Generally, there are many electronic components welded on the circuit board, and various electronic components will generate electromagnetic waves when they are in operation, and will also be affected by external electromagnetic interference. Therefore, the existing technical proposal proposes a shielding device. Please refer to Figure 6 , 7 As shown in and 8, a shielding device 40 is arranged on a circuit board 50 for various electronic components (not shown) on the circuit board 50 to shield external electromagnetic waves, resist interference, or shield the electromagnetic waves generated by the electronic components themselves , to avoid electromagnetic waves affecting other electronic components. [0003] Generally speaking, the circuit board 50 is provided with a p...
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IPC IPC(8): H05K9/00H05K1/02
CPCH05K1/0216H05K9/0024H05K2201/0707
Inventor 林定皓张乔政贾咏麟
Owner KINSUS INTERCONNECT TECH