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Cooling assembly and electronic device

A technology for heat dissipation components and electronic devices, applied in circuit devices, circuit thermal devices, printed circuit components, etc., can solve the problems of electronic equipment temperature rise, chip power consumption, etc., to avoid local overheating, enhance thermal conductivity, and improve grip The effect of holding

Active Publication Date: 2018-10-02
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise.

Method used

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  • Cooling assembly and electronic device

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Embodiment Construction

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0020] The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-e...

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Abstract

The invention discloses a cooling assembly and an electronic device. The cooling assembly comprises a circuit board, a hot source chip, a shielding cover, a metal heat conduction piece and a hot pipe,wherein the hot source chip is arranged on the circuit board, the shielding cover covers the circuit board and encircles the hot source chip, a first hollow region is arranged on a top wall of the shielding cover and is corresponding to the hot source chip, the metal heat conduction piece is arranged in the first hollow region, the metal heat conduction piece and the shielding cover are used forjointly performing signal shielding on the hot source chip, an evaporation segment of the hot pipe is arranged at one side, far away from the hot source chip, of the metal heat conduction piece, and the hot pipe is used for conducting out heat of the hot source chip. By the mode, on one hand, a part of the shielding cover is substituted by the metal heat conduction material, and the heat conductivity of the shielding cover can be improved; and on the other hand, the problem of local overheat of the electronic device is prevented, and damage to a component due to local overheat is prevented.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a heat dissipation component and an electronic device. Background technique [0002] The interior of an electronic device generally includes a control chip (ie, a core processor). With the diversification and intelligence of its functions, the requirements for the chip are also very high. The main frequency of current chips is generally 1GHz, 2GHz or even higher, and dual-core, quad-core and even eight-core chips are very common. [0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise. Contents of the invention [0004] A technical solution adopted in this application is to provide a heat dissipation assembly, which includes: a circuit board; a ...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0203H05K1/0216
Inventor 田汉卿
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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