Cooling assembly and electronic device
A technology for heat dissipation components and electronic devices, applied in circuit devices, circuit thermal devices, printed circuit components, etc., can solve the problems of electronic equipment temperature rise, chip power consumption, etc., to avoid local overheating, enhance thermal conductivity, and improve grip The effect of holding
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[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It can be understood that the specific embodiments described here are only used to explain the application, but not to limit the application. In addition, it should be noted that, for ease of description, the drawings only show a part of the structure related to the present application instead of all of the structure. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.
[0020] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific sequence. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion....
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