An extrusion type electronic circuit board production equipment

Abstract

The invention discloses extrusion-type electronic circuit board production equipment comprising a processing casing; an inlet is arranged in middle of the front end of the processing casing; hinges are symmetrically fixed on the left side of the front end of the inlet; a door plate is fixedly connected on the right side of the hinges; an air inlet hole is arranged in middle of the left end of theprocessing casing; a leak net plate is fixed on the inner wall of the air inlet hole; an air outlet hole is arranged on the upper side of the right end of the processing casing; an air outlet pipe isfixedly connected on the right port of the air outlet hole; the elastic force of a bevel spring can cancel a hard press force of a pressure plate on multi-layer circuit boards, thus reducing hard damages on the multi-layer circuit boards by the pressure plate in a lamination process; when an exhaust fan rotates to suck air, substrate powders and impurities are discharged onto a cloth boa inner wall; the air can be discharged via cloth bag apertures, thus effectively absorbing the substrate powders and impurities in the processing casing, and ensuring the compacting quality of the multi-layer circuit boards.

Description

technical field [0001] The invention relates to the technical field of electronic circuit board production, in particular to an extrusion type electronic circuit board production equipment. Background technique [0002] The production method of multi-layer board is generally to make the inner layer graphics first, and then make a single-sided or double-sided substrate by printing and etching method, and put it into the specified layer, and then press it with glue. As for the subsequent drilling, it is the same as double-sided The plated through hole method for the panel is the same. [0003] Existing extrusion-type electronic circuit board production equipment uses hydraulic telescopic cylinders to drive the pressure plate to directly press the bonded multi-layer circuit board downwards, so that the internal substrates of the multi-layer circuit board are completely pressed together, but the pressure plate and the The multi-layer circuit boards are in hard pressure contact,...

AI Technical Summary

Problems solved by technology

[0003] Existing extrusion-type electronic circuit board production equipment uses hydraulic telescopic cylinders to drive the pressure plate to directly press the bonded multi-layer circuit board downwards, so that the internal substrates of the multi-layer circuit board are completely pressed together, but the pressure plate and the The multi-layer circuit boards are in hard pressure contact, which will cause great damage to the internal structure of the multi-layer circuit boards. At the same time, most of the production equipment is non-closed, especially in the process of pressing the multi-layer circuit boards by the pressure plate. The substrate powder and other impurities in the air will be pressed on the top of the multilayer circuit board, resulting in low quality of the finished multilayer circuit board. The deviation of the internal substrate seriously affects the pressing effect

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