34results about How to "Easy to control shape" patented technology

The invention relates to medical porous polyether-ether-ketone with a drug loading function and a preparing method and application thereof. The medical porous polyether-ether-ketone has a uniform porous structure or gradient change type porous structure, pore size is 0.05-2 mm, and porosity is 10-90%. During preparation, molten polyether-ether-ketone is extruded into preform pores through pressure casting, and then preform is etched off with the chemical method to form the porous polyether-ether-ketone. The material has excellent mechanical property, and pore size and porosity are controllable. The porous structure of the material can be loaded with drugs to prevent infection and promote bone growth and healing. Compared with the prior art, the medical porous polyether-ether-ketone with the drug loading function and the preparing method and application thereof have the advantages that operation is easy, structure is controllable, drug loading is convenient, drug binding is firm, and cost is low.

The invention relates to application of a porous magnesium alloy as a carrier in medicine. Drugs can be carried onto the porous magnesium alloy to be used as a blood vessel stent, bone repair or bone propping material. The porous magnesium alloy is prepared by direct foaming, corrosion pore forming, laser drilling, powder metallurgy, quick forming, co-permeation vibration, 3D printing and the like. Laser cladding, microarc oxidation, anode oxidation, osmosis, embedding, solvent evaporation drying, melting, adsorption equilibrium and the like are performed to carry drugs into the porous magnesium alloy surface or the inside of the porous structure, thereby performing the functions of increasing the surface activity, promoting the bone cell growth and differentiation, preventing infection, implementing specific drug delivery and partial drug delivery and the like. The preparation method is simple to operate and easy to implement, and has the advantages of controllable structure, convenient drug carrying, firm drug combination, low cost and the like.

The invention discloses a magnetic nanometer particle compound and making method and application to separate nucleic acid especially mRNA, which comprises the following three layers: (1) inner nuclear layer with magnetic nanometer particle with superparamagnetism, (2) biological inert outer layer to clad inner nuclear layer, (3) decorating layer with affinity or antibiotin on the surface of outer layer.

The invention relates to an application of porous titanium alloy in medical science as a carrier. The application comprises the following steps: 1, winding and braiding medical titanium alloy wires to prepare porous titanium alloy; and 2, loading a drug to the surface or the porous structure of the porous titanium alloy through laser cladding, micro-arc oxidation, anodization, osmosis, an entrapping method, a solvent volatilization, a melting method or an adsorption balancing method. The porous titanium alloy can be used as an artificial joint, spinal column fusion, bone filling, bone restoration or bone transplantation material in order to realize surface activity increase, osteocyte growth and differentiation promotion, infection prevention, targeted administration and local administration effects. Compared with carriers in the prior art, the porous titanium alloy used as the carrier has the advantages of simplicity and easiness in operation, controllable structure, convenience in drug load, firm drug combination and low cost.

The invention discloses growth equipment for preparation of magnesium fluoride crystals with a multi-crucible descending method and a growth method. A porous graphite crucible comprises four parts including a seed crystal zone, a crystal growth zone, a bin zone and a crucible lid; the growth equipment further comprises a furnace hearth, a descending device and a copper induction heating coil, ventilating holes are formed in the upper side and the lower side of the furnace hearth, the inner wall of the furnace hearth, and the copper induction coil and a descending rod surface are plated with a nickel layer or a high-temperature-resistant organic resin layer which can resist corrosion of gases such as hydrogen fluoride and the like. The preparation method comprises steps as follows: parameter setting, furnace charging, vacuum pumping, introduction of protecting gases, waiting for complete melting of raw materials and forming of melts, starting of descending after seed crystals are melted to be thin and preparation of the magnesium fluoride crystals. The prepared magnesium fluoride crystals have excellent optical quality, and the transmittance of 190 nm wavelength can reach 93.5%; the appearance and the size of the magnesium fluoride crystals are easy to control; the magnesium fluoride crystals grow simultaneously in multiple crucibles, the growth efficiency is high, and industrial production is facilitated.

The invention relates to a preparation technology of a white chip for an LED (Light Emitting Diode). The white chip comprises fluorescent powder prefabricated thin films (101, 201) for the white LED, bonders (104, 204) and LED chips (102, 202). The preparation method comprises the steps of: placing the LED chip (202) on a metal plate (203) with a groove; bonding the fluorescent powder prefabricated thin film (201) for the white LED on the LED chip (202) through the bonder (204); and solidifying the bonder at 80-200 DEG C for 1-6 hours to obtain the white chip for the LED; or adhering the LED chip (102) on a blue film (103); adhering the fluorescent powder prefabricated thin film (101) for white LED on the LED chip (102) through the naturally solidified bonder (104); standing for 1-10 hours and curing the bonder naturally to obtain the white chip for the LED.

The invention provides an induction heating upsetting device for an aluminum alloy cylinder. The induction heating upsetting device comprises a headstock, an upsetting mechanism, an upsetting supportring, an induction coil, a forming die and a tailstock; the front end of the upsetting support ring is arranged on the headstock, the upsetting mechanism is arranged on the upsetting support ring in asleeving mode, the induction coil is arranged at the rear end of the upsetting support ring and is fixed at the front end of the forming die, and the rear end of the forming die is fixed on the tailstock; the central axes of the upsetting support ring, the induction coil and the forming die are positioned on the same straight line; the upsetting support ring can move relative to the induction coil along the axial direction; and the shapes of the upsetting support ring, the induction coil and the forming die are matched with each other. The induction heating upsetting device for the aluminum alloy cylinder in the invention greatly facilitates automation, the operation is simple, the size and the shape of a finished upsetting product are easy to control, the upsetting requirements of all aluminum alloy cylinders can be basically met, and great application prospect and market value are achieved.

The object of this invention is to provide a radiation-sensitive resin composition which is suitably used for simultaneously forming protrusions and spacers of a vertical alignment liquid crystal display element. The radiation-sensitive resin composition for simultaneously forming the protrusions and the spacers for the vertical alignment liquid crystal display element contains: a copolymer [A] of an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride (a1), an unsaturated compound having an epoxy group or an oxetanyl group (a2) and an olefinically unsaturated compound other than (a1) and (a2) (a3); and a photo-cationic polymerization initiator [B].

The invention provides a preparation method for samarium-doped cerium oxide solid electrolyte powder, and belongs to the field of a fuel cell. The preparation method is characterized by comprising the steps of preparing cerium nitrate, samarium nitrate and ammonium carbonate into solutions A and B, adding a BYK series dispersing agent into an ammonium carbonate solution, and preparing citric acid, oxalic acid and ammonium chloride into a solution C; mixing the solution A and the solution C in deposition, and dropwise adding into the solution B, and stirring and reacting to generate precipitates; and performing separating, cleaning, drying, calcining and smashing on the precipitates to obtain nanoscale SDC powder. By virtue of the preparation method, the nanoscale, spherical and high-dispersity SDC powder can be obtained easily; the overall technological process of the method can be controlled easily, and the process is convenient and rapid; meanwhile, the stability of the production process is improved, and the uniformity and consistency of the product are enhanced; and the powder state is quite beneficial to the subsequent preparation of a solid electrolyte thin film.

The invention discloses a method for preparing a graphene-base superconductive capacitor electrode. The method comprises steps of: (a) dispersing graphene in a liquid medium to prepare graphene dispersions containing a foaming agent; (b) depositing the dispersions on a base material to form a liquid film; (c) removing the liquid medium to form a dry graphene material layer; (d) thermally treating the dry layer at a temperature of 85 to 2500 degrees centigrade so that non-carbon volatile gas molecules volatilizes and the foaming agent foams to generate a grapheme foam layer; and (e) impregnating the graphene foam layer with an electrolyte to form a pre-impregnated graphene foam layer and then compressing the pre-impregnated graphene foam layer to form the grapheme-base superconductive capacitor electrode. The method subjects the graphene to foaming treatment to improve specific surface area and load capacity and to achieve good electrical conductivity and large capacity, and then performs pressing to achieve high tap density, large energy density, high active load, a long cycle life, and easy shape control.

The invention relates to a method for manufacturing an LED streetlight lens, comprising the following steps: setting a basic bottom part plane of a lens; setting the reflecting part of the lens; and setting the refraction bright dipping part of the lens. The invention also discloses an LED streetlight lens. The beneficial effect is as follows by implementing the manufacturing method of the LED streetlight lens and the lens thereof: due to independent designing or selecting each component of the reflecting surface and the refraction bright dipping part of the lens, the lens has good bright dipping effect, and the lighting area and shape thereof are easy to control.

The invention provides a monocrystalline silicon wafer. The monocrystalline silicon wafer comprises a silicon wafer body, the silicon wafer body comprises a plurality of straight wall parts and a plurality of chamfer parts, the straight wall parts and the chamfering parts are sequentially and alternately connected end to end, the chamfering parts are linear, and the included angle between a straight line formed by connecting the end point of any end of each chamfering part and the center point of the silicon wafer body and the crystal direction of the silicon wafer body (110) is not smaller than 0.35 degree and not larger than 3.2 degrees. The monocrystalline silicon wafer has the beneficial effects that the monocrystalline silicon wafers are provided with the chamfering parts, and the chamfering parts are linear, so that the poor positioning effect of the monocrystalline silicon wafers during downstream battery electrode printing and battery assembly assembling is avoided, and the dislocation phenomenon occurring during monocrystalline silicon wafer splicing is avoided; and meanwhile, in the preparation process of the monocrystalline silicon rod, the polishing mode that the monocrystalline silicon rod does not rotate and the polishing grinding wheel rotates is adopted, so that the consistency of the corner angle polishing radian of the monocrystalline silicon rod is good.

The base seat with ring body is composed of following arts: a base plate possesses at least an insulating layer and a circuit layer; a ring body setup on surface of the base plate; being setup on surface of the base plate circled by the ring body, a chip of light emitting diode (LED) is connected to the circuit layer on the base plate electrically, height of the ring body on the base plate is larger than height of the LED on the base plate; being prepared from euphotic material, an euphotic colloid layer is in use for covering the chip of LED so as to prevent the chip of LED from contacting outside directly.

The invention discloses an ultraviolet curing adhesive for insulation protection, a preparation method and an application thereof. The ultraviolet curing adhesive is composed of the following components by weight percentage: 50% to 90% of organosilicon modified acrylate, 5% to 35% of an acrylate reactive diluent, 1% to 8% of a photoinitiator, and 0% to 10 % of an auxiliary agent; the organosiliconmodified acrylate is synthesized from hydroxyl terminated polydimethylsiloxane, methylene dicyclohexyl diisocyanate, hydroxy acrylate and a polymerization inhibitor. In addition, the invention also discloses a preparation method of the ultraviolet curing adhesive and an application thereof. The viscosity of the ultraviolet curing adhesive reaches 10000 mPa or more, the ultraviolet curing adhesiveis not easy to sag, and the UV-curable double bonds are introduced into the organosilicon molecular chain, the high-flexibility ultraviolet curing adhesive is prepared, the insulating electrical strength of the ultraviolet curing adhesive after UV curing reaches 20KV/mm or more, and the ultraviolet curing adhesive can be applied to the insulation protection of bare electrical core aluminium edgeof a soft-packed secondary lithium battery.

The process of composing nanometer Ag-Ni alloy includes the following steps: adding ammonia water to the mixed solution of NiSO4 in 0.70-1.80 mol/L and AgNO3 in 1.00-2.50 mol/L to regulating pH value to 7.5-8.5, adding certain amount of polyvinyl pyrrolidone, heating to 60-80 deg.c, adding reductant N2H4.H2O in 1.50-3.00 mol/L to produce reaction reaction; filtering, washing the obtained powder with alcohol and acetone, drying at normal temperature to obtain nanometer level Ag-Ni alloy powder; sintering at 600-650 deg.c and 15-25 MPa for 10-15min to obtain high density crystallized Ag-Ni alloy. The process features the convenient operation, molecule level mixing of the reactant components and homogeneous micro alloy structure.

The invention discloses a method for preparing a graphene membrane from a graphite liquid CO2 suspension. The device comprises an insulation barrel, a stirrer and a volatilization disc; the method ischaracterized by comprising the following steps: adding the liquid CO2 with ultralow viscosity, ultra-strong flowability, ultra-strong permeability and super-strong adsorbability and high-mesh graphite powder into the sealed insulation barrel and stirring same; further breaking the graphite particles into suspension liquid with uniformly mixed free carbon atoms; pouring the suspension liquid intoa volatilization disc, allowing carbon atoms to settle due to the difference of specific gravity, wherein under condition of no interference of upper and lower atom motion power, carbon atoms firstlyreaching plane of volatilization disc are mutually combined to form two-dimensional crystallized graphene membrane.; compared with the prior art, the preparation method disclosed by the invention hasthe characteristics of simple use facilities, rich raw material sources, mature application technology and the like, and also has the advantages of high graphene preparation efficiency, easy control of size and shape, random composite layer thickness and the like, so that the preparation method has very good popularization and application values.

The present invention provides a packaging method of a wafer chip and a structure of a wafer chip. The method comprises the steps of: forming a conductive convex column on a welding pad at the front surface of a wafer; forming a welding column on the conductive convex column, wherein the section area of the welding column is not changed in the thickness direction; forming a first plastic layer atthe front surface of the wafer, the conductive convex column and the periphery of the welding column; and executing a thinning program for the first plastic layer to allow the welding column to be exposed. The packaging method of the wafer chip and the structure of the wafer chip are good in weldability, simple in preparation process, low in cost, high in yield, smaller in the packaging product size and thinner in thickness.

The invention discloses a method for machining a porous-surface heat-exchange pipe for boiling heat-transfer equipment, aiming at providing a heat-exchange pipe and a machining method with the advantages of simple process, convenience for machining, no falling of a machined porous surface and capability of machining various complex structural forms. The method comprises the steps of: cutting an aluminum alloy sheet according to developed dimensions of a base pipe and a porous layer of a heat-exchange pipe respectively to obtain aluminum alloy sheets which are respectively used for machining the base pipe and the porous layer and have the same dimensions as the developed dimensions of the base pipe and the porous layer of the heat-exchange pipe; respectively evening out; placing the evened-out aluminum alloy sheet for machining the porous layer in the middle of a terrace die and a hollowing die, and punching the aluminum alloy sheet for machining the porous layer by using the terrace die and the hollowing die; superposing and thermally pressing a porous layer substrate and the evened-out aluminum alloy sheet for machining the base pipe so that the porous layer substrate and the evened-out aluminum alloy sheet for machining the base pipe are integrated; and then, machining the evened-out aluminum alloy sheet for machining the base pipe into a pipe shape, and welding both the machined aluminum alloy sheets to obtain the aluminum alloy heat-exchange pipe with the porous surface.

The invention provides a base material with high surface binding force and a preparation method thereof. The preparation method comprises the following steps of testing the diameter and depth of a micro-pit on the base material after a single pulse reacts with a material by using pulse laser. By changing the power or the number of machining times, a relation curve between the single-pulse energy and the number of machining times and the size and depth of the micro-pit can be obtained, and in practical application, a certain machining path and a certain scanning speed can be rapidly set for machining according to the relation curve and the size of the needed micro-pit, and thus, a high-binding-force base material with micro-pits regularly arranged and non-overlapped on the surface of the base material. According to the method, the roughness, the binding force and the variable surface tension (hydrophilic-hydrophobic property) of the surface of the base material can be remarkably improved. The preparation method is particularly suitable for a hydrophobic substrate, and the hydrophilicity of the hydrophobic substrate is remarkably improved after laser processing, so that the deposition speed of the hydrophobic substrate in an aqueous solution can be increased, the wettability can be improved, and the deposition speed of the material can be increased.