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Saw blade grasping assembly, transmission device, electroplating device and electroplating method

An electroplating device and saw blade technology, which is applied to electrolytic components, electrolytic processes, cells, etc., can solve the problems of inability to synchronize material feeding, inability to meet streamlined production, and inability to realize circular saw blade grabbing, etc.

Inactive Publication Date: 2020-10-23
RIZHAO HEIN SAW
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The inventor found that the hanger in the above-mentioned patent has the following disadvantages: although the product to be electroplated can be positioned and transported, the device cannot grasp the circular saw blade, and the material is loaded and unloaded in a push-pull manner, so that the material is unloaded during the unloading process. The process cannot be loaded synchronously, which cannot meet the needs of streamline production, and manual loading of each product is required, which is inefficient

Method used

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  • Saw blade grasping assembly, transmission device, electroplating device and electroplating method
  • Saw blade grasping assembly, transmission device, electroplating device and electroplating method
  • Saw blade grasping assembly, transmission device, electroplating device and electroplating method

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Embodiment Construction

[0036] The technical solution of this patent will be described in further detail below in conjunction with specific embodiments.

[0037] The embodiments of the present patent are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the patent, and cannot be understood as a limitation to the patent.

[0038] In the description of this patent, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the patent and simplif...

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Abstract

The invention relates to a saw blade grasping assembly, a transmission device, an electroplating device and an electroplating method, and belongs to the technical field of circular saw blade electroplating. The assembly comprises a capsule-shaped shell that can shrink and expand when a force is applied in the length direction, wherein one end of the capsule-shaped shell is provided with a first coupling member; the assembly also comprises a second coupling member that is snap-connected to the first coupling member; and the second coupling member can be deflected and separated from the first coupling member when a force is applied. Through the capsule-shaped shell running through the central hole of the saw blade, the saw blade can be grasped through shrinkage and expansion. At the same time, the electroplating device containing the grabbing assembly can realize the simultaneous operation of different stations by cooperating with a feeding conveying component, a electroplating tank anda discharging conveying assembly, so that the loading, unloading, electroplating and drying work can be performed simultaneously, with no need for manual participation, which saves manpower and improves production efficiency.

Description

Technical field [0001] The present disclosure belongs to the technical field of circular saw blade electroplating, and specifically relates to a saw blade grasping assembly, a transmission device, an electroplating device and an electroplating method. Background technique [0002] The statements here only provide background art related to the present disclosure, and do not necessarily constitute prior art. [0003] Electroplating refers to a surface processing method in which the base metal to be plated is used as the cathode in the salt solution containing the metal to be plated, and the cations of the metal to be plated in the plating solution are deposited on the surface of the base metal through electrolysis to form a plating layer. . The coating performance is different from the base metal and has new characteristics. According to the function of the coating, it can be divided into protective coatings, decorative coatings and other functional coatings; in the production and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/06C25D21/10
CPCC25D17/00C25D17/06C25D21/10
Inventor 王兴雷李洪涛鞠军伟
Owner RIZHAO HEIN SAW
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