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Base material with high surface binding force and preparation method thereof

A technology with high bonding force and high surface, applied in welding equipment, manufacturing tools, laser welding equipment, etc., can solve problems such as complex process, environmental pollution by chemical methods, and small application range of coarsening formula, so as to change the hydrophilicity and hydrophobicity, and the application range Wide, simple and clear effect of adjustment process

Pending Publication Date: 2021-09-28
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chemical method pollutes the environment, and each coarsening formula has a small scope of application
The electrochemical method requires the substrate to be conductive, and the process is complicated

Method used

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  • Base material with high surface binding force and preparation method thereof
  • Base material with high surface binding force and preparation method thereof
  • Base material with high surface binding force and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041]The material selected in this embodiment is an LCP thin film insulating material with a film thickness of 100 μm, which needs to be plated with copper on the surface, and sandblasting will deform or damage the material. LCP itself has good chemical resistance, but chemical roughening is difficult.

[0042] A method for preparing a substrate with high surface binding force, the method comprising the steps of:

[0043] 1) Laser selection: use different types of pulsed lasers to scan the surface of the substrate (1) in the form of a single pulse laser beam, and form micropits (2) on the surface, and measure the diameter of the micropits (2) formed on the substrate Size and depth, and select the type of pulsed laser that can react with the surface of the substrate;

[0044] In this embodiment, the DirectLaser 550U ultraviolet nanosecond laser machine produced by Dezhong (Tianjin) Technology Development Co., Ltd. is preferably used to carry out the laser processing test.

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Embodiment 2

[0063] The material selected in this embodiment is an FR4 insulating material with a thickness of 0.5 mm, and copper plating and copper plating are required on the surface. After the material is roughened by plasma treatment or traditional degumming methods such as potassium permanganate, foaming problems will occur when copper is deposited. Enhanced treatment conditions, or a combination of the two treatment methods, copper sinking does not bubble, but is directly delaminated after copper plating.

[0064] 1) Laser selection: use different types of pulsed lasers to scan the surface of the substrate (1) in the form of a single pulse laser beam, and form micropits (2) on the surface, and measure the diameter of the micropits (2) formed on the substrate Size and depth, and select the type of pulsed laser that can react with the surface of the substrate;

[0065] In this embodiment, the DirectLaser 550U ultraviolet nanosecond laser machine produced by Dezhong (Tianjin) Technolog...

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Abstract

The invention provides a base material with high surface binding force and a preparation method thereof. The preparation method comprises the following steps of testing the diameter and depth of a micro-pit on the base material after a single pulse reacts with a material by using pulse laser. By changing the power or the number of machining times, a relation curve between the single-pulse energy and the number of machining times and the size and depth of the micro-pit can be obtained, and in practical application, a certain machining path and a certain scanning speed can be rapidly set for machining according to the relation curve and the size of the needed micro-pit, and thus, a high-binding-force base material with micro-pits regularly arranged and non-overlapped on the surface of the base material. According to the method, the roughness, the binding force and the variable surface tension (hydrophilic-hydrophobic property) of the surface of the base material can be remarkably improved. The preparation method is particularly suitable for a hydrophobic substrate, and the hydrophilicity of the hydrophobic substrate is remarkably improved after laser processing, so that the deposition speed of the hydrophobic substrate in an aqueous solution can be increased, the wettability can be improved, and the deposition speed of the material can be increased.

Description

technical field [0001] The invention relates to the technical field of surface processing, in particular to a base material with high surface binding force and a preparation method thereof. Background technique [0002] In industrial manufacturing, it is widely used to compound another material on one material. The performance of the resulting composite material is highly dependent on the bonding force between the two materials. Therefore, in industry, the bonding force is an important factor for materials. parameter. [0003] Mechanical method or chemical method is currently the most commonly used method to improve the bonding force. It roughens the surface of the workpiece through mechanical wear or chemical corrosion to obtain a microscopic rough structure on the surface of the workpiece. This roughening increases the contact area between the two materials while increasing the peel strength between the two, thereby improving the bond. However, these methods have many di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/082B23K26/70
CPCB23K26/082B23K26/702
Inventor 王恒亮
Owner 德中(天津)技术发展股份有限公司
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