2results about How to "Depth adjustable" patented technology

The utility model relates to the technical field of deep foundation pit deformation monitoring, in particular to a deep foundation pit deformation monitoring device which comprises a deformation monitor and a supporting and installing part used for supporting and installing the deformation monitor. The deformation monitoring part is arranged in the supporting mounting part and is used for monitoring deformation of the deep foundation pit; the automatic rainy day protection part is arranged on the upper side of the supporting and mounting part and used for performing rainy day protection on the deformation monitor, the automatic rainy day protection part comprises an electric push rod, the electric push rod is arranged in the supporting and mounting part, a transparent protection cover is arranged at the output end of the electric push rod, and an automatic cleaning assembly is arranged on one side of the transparent protection cover; according to the utility model, all-weather monitoring and automatic protection functions are provided, through the arrangement of the rainy day automatic protection part, under the triggering of the rainfall sensor, the electric push rod automatically drives the transparent protection cover to cover the deformation monitor, so that rainwater erosion or mirror surface pollution is avoided, and the continuity of monitoring data is ensured.

The application discloses a process method of sand blasting before machining for high-quality and high-efficiency machining of hard and brittle materials, and belongs to the technical field of precision machining of hard and brittle materials. In view of the problems of easy edge collapse, cracks and low machining efficiency of hard and brittle materials in cutting, sand blasting treatment is performed on the surface to be machined of a workpiece before mechanical cutting machining, a uniform micro-crack damage layer is formed in a controllable manner on the material surface layer by using the impact of high-speed abrasive particles, and the bonding strength of the surface layer is weakened; subsequent cutting machining is then performed, so that the material is mainly removed in brittleness and secondarily removed in ductility, the cutting force and tool wear are significantly reduced, defects such as edge collapse and cracks are inhibited, and the machining surface quality and machining efficiency are improved. The process is simple and has strong adaptability, and can be widely applied to the precision and high-efficiency cutting machining scenes of various hard and brittle materials such as ceramics, monocrystalline silicon and sapphire.