Preparation method of white chip for LED (Light Emitting Diode)

A LED chip and white light technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low uniformity, yellow circles, light spots, etc., achieve good consistency of light emission, reduce raw material costs, and improve product yield Effect

Inactive Publication Date: 2013-04-17
XIANGLING LED
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  • Abstract
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Problems solved by technology

Using the existing method to manufacture white light LEDs will cause different batches and LEDs produced in the same batch to have different light chromaticity due to the concentration change of phosphor powder in the colloid during production, due to the mixture of phosphor powder and colloid on the chip surface Inconsistency in thickness results in poor light consistency, low uniformity, yellow circles, spots, etc.

Method used

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  • Preparation method of white chip for LED (Light Emitting Diode)
  • Preparation method of white chip for LED (Light Emitting Diode)

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Embodiment Construction

[0025] The preparation method of a white light chip for an LED comprises raw materials of a prefabricated film (101, 201) of fluorescent powder for a white light LED, an adhesive (104, 204), and an LED chip (102, 202). It is characterized in that the chip (102) for LED is pasted on the blue film (103), and a prefabricated film (101) of fluorescent powder for white light LED is pasted on the LED chip (102) through an adhesive (104). Above, at an ambient temperature of 80-200° C. for 1 to 6 hours, the adhesive is cured to obtain a white light chip for LED. Or paste the chip (202) for LED on the blue film (203), and paste a prefabricated film (201) of phosphor powder for white light LED on the LED chip (202) through a naturally curable adhesive (204). and stand still for 1 to 10 hours to allow the adhesive (204) to cure naturally to obtain a white light chip for LED.

[0026] The shape and size of the phosphor prefabricated film (101, 201) for a white light LED completely coinci...

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Abstract

The invention relates to a preparation technology of a white chip for an LED (Light Emitting Diode). The white chip comprises fluorescent powder prefabricated thin films (101, 201) for the white LED, bonders (104, 204) and LED chips (102, 202). The preparation method comprises the steps of: placing the LED chip (202) on a metal plate (203) with a groove; bonding the fluorescent powder prefabricated thin film (201) for the white LED on the LED chip (202) through the bonder (204); and solidifying the bonder at 80-200 DEG C for 1-6 hours to obtain the white chip for the LED; or adhering the LED chip (102) on a blue film (103); adhering the fluorescent powder prefabricated thin film (101) for white LED on the LED chip (102) through the naturally solidified bonder (104); standing for 1-10 hours and curing the bonder naturally to obtain the white chip for the LED.

Description

technical field [0001] The invention relates to an LED manufacturing technology, in particular to a method for preparing a white light chip for an LED. Background technique [0002] At present, the mainstream white light LED uses yellow phosphor colloid to coat the blue light chip, and the yellow phosphor is excited by the blue light emitted by the blue light chip to emit white light. The chip process is grown by MOCVD process, and then the GaN light-emitting layer is made of metal electrodes through various processes, and then polished and cut into a single LED chip. Using the existing method to manufacture white light LEDs will cause different batches and LEDs produced in the same batch to have different light chromaticity due to the concentration change of phosphor powder in the colloid during production, due to the mixture of phosphor powder and colloid on the chip surface Inconsistencies in thickness lead to poor light consistency, low uniformity, yellow circles, spots...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/00
Inventor 高扬刘建龙邓顺明吴政明吴家骅徐颖
Owner XIANGLING LED
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