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Black photosensitive resin composition

A photosensitive resin and composition technology, applied in optics, optomechanical equipment, and photosensitive materials for optomechanical equipment, etc., can solve the problem that light is difficult to reach the solder resist coating film uniformly, lack of clarity, and the covering power of the coating film. Insufficient and other problems, to achieve excellent clarity and covering power, improve clarity and covering power, reduce the effect of compounding amount

Pending Publication Date: 2018-10-09
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the black solder resist composition of Patent Document 1 is black, it is difficult for light to uniformly reach the deep part of the solder resist coating film, the photocuring of the deep part of the solder resist coating film is insufficient, and the clarity is insufficient.
[0005] On the other hand, if the compounding amount of the black colorant is limited in order to obtain clarity, there is a problem that the hiding power of the coating film becomes insufficient

Method used

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  • Black photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～3

[0071] Examples 1 to 8 and Comparative Examples 1 to 3 were prepared by blending the components shown in the following Table 1 at the ratios shown in the following Table 1, and mixing and dispersing the above components at room temperature using a triple roller. A black photosensitive resin composition used in The numbers in Table 1 below represent parts by mass. In addition, blank columns in the following Table 1 indicate non-combination.

[0072] In addition, the details of each component in Table 1 are as follows.

[0073] (A) Photosensitive resin containing carboxyl group

[0074] · KAYARAD ZAR-2000, KAYARAD ZCR-1569H: Nippon Kayaku Co., Ltd.

[0075] (B) Photopolymerization initiator

[0076] · NCI-831: ADEKA Corporation

[0077] (C) Reactive diluent

[0078] ·EBECRYL 8405: Daicel-sytec Ltd.

[0079] (D) epoxy compound

[0080] · EPICLON 850-S: DIC Corporation

[0081] ·NC-3000: Nippon Kayaku Co., Ltd.

[0082] carbon black

[0083] · MA-14, MA-7: Mitsubishi Ch...

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Abstract

The present invention provides a black photosensitive resin composition, capable of obtaining a cured product which does not deteriorate basic characteristics such as sensitivity and insulation reliability and has excellent sharpness and covering power. The black photosensitive resin composition of the present invention contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a reactive diluent, (D) an epoxy compound, and (E) carbon black dispersion.

Description

technical field [0001] The present invention relates to a black photosensitive resin composition having excellent clarity and hiding power, and relates to a black photosensitive resin composition that can cope with fine pitch and miniaturization of electrodes when used as an insulating coating such as a solder resist for printed wiring boards permanent resin composition. Background technique [0002] A printed wiring board is used to form a pattern of a conductor circuit on a substrate and to mount electronic components on the solder pads of the pattern by soldering, and remove the soldering with an insulating film (such as a solder resist film). The part of the circuit other than the pad is covered. Accordingly, when soldering the electronic component to the printed wiring board, it is possible to prevent the solder from adhering to unnecessary parts, and to prevent the circuit conductors from being directly exposed to the air and being corroded by oxidation or humidity. ...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027
CPCG03F7/004G03F7/027
Inventor 石坂将畅上杉尚之斋藤隆英堀泽和宽
Owner TAMURA KK