Photosensitive composition, hardened film, color filter, display element, solid-state shooting element, and light-emitting diode illuminator

A technology of photosensitive composition and hardened film, applied in optical elements, photosensitive materials for opto-mechanical equipment, optics, etc., can solve the problems of unsatisfactory adhesion and difficulty in making high-quality display elements, etc. To achieve the effect of improving display quality and reliability, and high practicability

Inactive Publication Date: 2018-10-09
JNC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Especially when these photosensitive compositions are used as color filter protective films, if these highly polar organic solvents are contained, they will penetrate into the color filter layer of the base, such as pigments or Coloring materials such as dyes are eluted, making it difficult to produce high-quality display elements
[0009] As an example of using a photosensitive composition in a protective film of a color filter, there is Patent Document 4, but the inventors of the present invention used the photosensitive composition described in these Patent Documents to form a protective film and to adhere to it. Confirmation was carried out, but the result was that the adhesion was not fully satisfactory, and further improvement was expected

Method used

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  • Photosensitive composition, hardened film, color filter, display element, solid-state shooting element, and light-emitting diode illuminator
  • Photosensitive composition, hardened film, color filter, display element, solid-state shooting element, and light-emitting diode illuminator
  • Photosensitive composition, hardened film, color filter, display element, solid-state shooting element, and light-emitting diode illuminator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0181] Next, the present invention will be specifically described by way of synthesis examples, reference examples, examples, and comparative examples, but the present invention is not limited by these examples. Furthermore, regarding the abbreviations of the compounds in Tables 1 to 2, M-520 is Aronix M-520 (trade name; Toagosei Co., Ltd.), a compound having a polymerizable double bond, and AA-6 is There is the compound AA-6 (trade name; East Asia Co., Ltd.) of polymerizable double bond, and NCI-930 is the photopolymerization initiator Adeka arc Luz (Adeka arc Luz) NCI-930 (trade name; Adeka (ADEKA Co., Ltd.), EHPE3150 is epoxy compound EHPE3150 (trade name; Daicel (Daicel) Co., Ltd.), VG3101L is epoxy compound VG3101L (trade name; Printec) Co., Ltd.), TMA is the epoxy hardener trimellitic anhydride, S510 is the coupling agent Sarah Ace (Sila-Ace) S510 (trade name; JNC Co., Ltd.), AO-60 is the antioxidant moxa ADK STAB (ADK STAB) AO-60 (trade name; ADEKA Co., Ltd.), F-556 is...

Synthetic example 1

[0183] [Synthesis Example 1] Synthesis of Polyester Amic Acid (A) Solution

[0184] In a four-necked flask with a stirrer, dehydrated and purified PGMEA, diethylene glycol ethyl methyl ether (hereinafter referred to as "EDM"), 4,4'-diphenyl Ether tetracarboxylic dianhydride (hereinafter abbreviated as "ODPA"), SMA1000P, 1,4-butanediol, and benzyl alcohol were stirred at 120° C. for 3 hours under a dry nitrogen stream.

[0185]

[0186] Thereafter, the reaction solution was cooled to 25°C, and 3,3'-diaminodiphenylsulfone (hereinafter abbreviated as DDS) and EDM were put into the following weight, and after stirring for 2 hours at 20°C to 30°C, Stirring was carried out at °C for 2 hours.

[0187] DDS 12.72g

[0188] EDM 29.68g

[0189] [Z / Y=2.0, (Y+Z) / X=i.0]

[0190] The solution was cooled to room temperature to obtain a 30% by weight solution of a pale yellow transparent polyester amic acid (A). A portion of the solution was sampled and the weight average molecular wei...

Synthetic example 2

[0191] [synthesis example 2] the synthesis of the copolymer (B) solution containing epoxy group

[0192] In a four-necked flask with a stirrer, dehydrated and purified MMP as a polymerization solvent, glycidyl methacrylate, and diethylene glycol dimethacrylate ( NK ester (NKEster) 2G; trade name; New Nakamura Chemical Industry Co., Ltd.), and then charged with 2,2'-azobis(2-methylpropionic acid) dimethyl ester ( V-601; trade name; Wako Pure Chemical Industries, Ltd.), stirring was performed at 110° C. for 2 hours under a stream of dry nitrogen.

[0193] MMP 31.50g

[0194] Glycidyl methacrylate 12.15g

[0195] Diethylene glycol dimethacrylate 1.35g

[0196] V-601 2.03g

[0197] The solution was cooled to room temperature to obtain a 30 wt% solution of the epoxy group-containing copolymer (B). A portion of the solution was sampled and the weight average molecular weight was determined by GPC analysis (polystyrene standard). As a result, the weight average molecular weight...

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PUM

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Abstract

The invention relates to a photosensitive composition, a hardened film, a color filter, a display element, a solid-state shooting element, and a light-emitting diode illuminator. The photosensitive composition contains polyester amic acid, a compound having a polymerizable double bond, a photopolymerization initiator, an epoxy compound, and an epoxy curing agent. In the photosensitive composition,the polyester amic acid is obtained by reacting a tetracarboxylic dianhydride, a diamine, and a polyvalent hydroxy compound as essential raw material components, and the compound having a polymerizable double bond contains two or more polymerizabilities per molecule. A compound having a polymerizable double bond contains more than two polymerizable double bonds having molecular weight of less than 1,000 in each molecule, and a compound having a polymerizable double bond and having a molecular weight of 1,000 or more. The photosensitive composition of the present invention can form a hardenedfilm which is excellent in transparency, heat resistance, solvent resistance, adhesion, flatness, and resolution without requiring an organic solvent having a high polarity.

Description

technical field [0001] The present invention relates to an insulating material in an electronic part, a passivation film, a buffer coating film, an interlayer insulating film or a planarizing film in a semiconductor device, or an interlayer insulating film in a display element or a protective film for a color filter. Photosensitive composition, cured film, color filter, display element, solid-state imaging element, and light-emitting diode light-emitting body used for formation of a film etc. Furthermore, it is related with the electronic component which has the transparent film formed using the said photosensitive composition, and the said film. Background technique [0002] In the manufacturing process of elements such as display elements, various chemical treatments such as organic solvents, acids, and alkali solutions are performed, or the surface is locally heated to a high temperature when forming a film of wiring electrodes by sputtering. Therefore, a surface protect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004C08F220/32C08F222/14C08F2/06C08G73/10
CPCC08F2/06C08F220/32C08F220/325C08G73/1064C08G73/1071G02B1/14G03F7/004G03F7/027C08F222/102
Inventor 尾崎刚史
Owner JNC CORP
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