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Color temperature adjustable LED structure

A technology of LED structure and color temperature, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of easy ash entry, uneven brightness, uneven color space distribution, etc. It is more difficult to increase the degree of

Pending Publication Date: 2018-10-12
SHINEON BEIJING TECH
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Problems solved by technology

[0004] In order to solve the problems of uneven distribution of color space, uneven brightness, and easy dust in the CSP interval in the LED structure with adjustable color temperature of the above-mentioned CSP chip package, an object of the present invention is to provide an LED with adjustable color temperature. structure

Method used

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Embodiment Construction

[0026] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0027] In one embodiment of the present invention, as figure 1 As shown, an LED structure with adjustable color temperature includes a substrate 4, a circuit layer 3 disposed on the substrate 4, a solder resist layer 5, a phosphor film 6, a flip-chip blue light chip 1 and a low color temperature CSP chip 2; the substrate 4 is provided with a positive electrode and a negative electrode; according to actual needs, the flip-chip blue-ray chip 1 and the low color temperature CSP chip 2 are evenly welded on the substrate 4 by r...

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Abstract

The invention discloses a color temperature adjustable LED structure. The structure comprises a substrate, a circuit layer and a solder resist layer disposed on the substrate, a low color temperatureCSP chip and an inverted blue ray chip uniformly in inverse soldering on the substrate and phosphor film covering the low color temperature CSP chip and the inverted blue ray chip for increasing the concentration of CIE; the phosphor film has a thickness of 0.1 mm to 0.5 mm; by respectively adjusting the current of the low color temperature CSP chip and the inverted blue ray chip, the adjustablecolor and temperature of the LED structure is achieved. The structure solves the technical problem in the prior art that uneven color space distribution and uneven brightness exist in a color temperature adjustable LED structure packaged by pure CSP chips by combining the low color temperature CSP chip and the inverted blue ray chip; by wrapping the phosphor film on the low color temperature CSP chip and the inverted blue ray chip, the CIE concentration of the LED structure is improved, and simple and efficient production of the customized color temperature adjustable LED structure is achieved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting. More specifically, it relates to an LED structure with adjustable color temperature packaged with a CSP chip. Background technique [0002] LED lights are gradually replacing traditional light sources due to their advantages of energy saving, environmental protection, high luminous efficiency and long life. With the improvement of people's requirements for the quality of life, in order to create different atmospheres, people hope to be able to adjust the indoor color temperature according to the situation. [0003] With the continuous maturity of CSP manufacturing technology, the application of CSP is increasing. In the prior art, most of the packaging forms and characteristics of the LED structure with adjustable color temperature packaged by CSP chips are as follows: CSPs with different color temperatures (usually warm and cool) are directly pasted on the COB substrate by SMT t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L33/50
CPCH01L25/167H01L33/505
Inventor 石建青孙国喜申崇渝刘国旭
Owner SHINEON BEIJING TECH
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