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Method for making white-light light-emitting diode

A technology of light-emitting diodes and manufacturing methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve the problems of color cast and the inability to adjust various color temperatures of white light according to needs, etc.

Active Publication Date: 2005-12-21
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation method of this white light diode can improve the uniformity and brightness of white light to a certain extent, but its disadvantages are: in the white light diode manufactured by this method, the properties of the mixture of phosphor powder and transparent resin determine the white light diode. The emitted white light will have a color cast after being used for a certain period of time, and the various color temperatures of the white light cannot be adjusted according to needs

Method used

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  • Method for making white-light light-emitting diode

Examples

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Effect test

Embodiment 1

[0010] like figure 1 , use the nitride blue light diode chip 1 as the excitation light source, weld the gold wire 2 after mounting, connect with the lead wire 5, and then coat and cure the epoxy resin 3 with higher viscosity on the chip 1 and the gold wire 2 to form a ball crown shape. Mix the transparent epoxy resin, fluorescent powder and diffusion powder in a weight ratio of 0.5:0.02:0.01, coat and cure the mixture on the spherical crown-shaped epoxy resin 3 to form a fluorescent layer 4 . The epoxy resin adopts high-viscosity transparent epoxy resin, the fluorescent powder adopts fluorescent powder with an anti-attenuation of more than 50,000 hours, the light transmission of the diffusing powder should be greater than 95%, and the refractive index is 2.5. During conventional curing treatment, the curing temperature is 130° C., and the curing time is half an hour. Finally, conventional encapsulation is performed with transparent resin to form a photomask 6 .

Embodiment 2

[0012] like figure 1 , use the nitride blue light diode chip 1 as the excitation light source, weld the gold wire 2 after mounting, connect with the lead wire 5, and then coat and cure the epoxy resin 3 with higher viscosity on the chip 1 and the gold wire 2 to form a ball crown shape. Mix the transparent epoxy resin, fluorescent powder and diffusion powder in a weight ratio of 0.9:0.06:0.02, coat and cure the mixture on the spherical crown-shaped epoxy resin 3 to form a fluorescent layer 4 . The epoxy resin adopts high-viscosity transparent epoxy resin, the fluorescent powder adopts fluorescent powder with an anti-attenuation of more than 50,000 hours, the light transmission of the diffusing powder should be greater than 95%, and the refractive index is 2.5. During conventional curing treatment, the curing temperature is 130° C., and the curing time is half an hour. Finally, conventional encapsulation is performed with transparent resin to form a photomask 6 .

Embodiment 3

[0014] like figure 1 , use the nitride blue light diode chip 1 as the excitation light source, weld the gold wire 2 after mounting, connect with the lead wire 5, and then coat and cure the epoxy resin 3 with higher viscosity on the chip 1 and the gold wire 2 to form a ball crown shape. The weight ratio of the transparent epoxy resin, fluorescent powder and diffusion powder is: 1.1:0.1:0.03. Mixing is carried out, and the mixture is coated and cured on the spherical cap-shaped epoxy resin 3 to form a fluorescent layer 4 . The epoxy resin adopts high-viscosity transparent epoxy resin, the fluorescent powder adopts fluorescent powder with an anti-attenuation of more than 50,000 hours, the light transmission of the diffusing powder should be greater than 95%, and the refractive index is 2.5. During conventional curing treatment, the curing temperature is 130° C., and the curing time is half an hour. Finally, conventional encapsulation is performed with transparent resin to form...

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Abstract

Light emitting diode chip of nitride is as excitation light source, and a gold wire is welded on the chip being installed on rack. Epoxy resin is coated on the chip and rack, and solidified epoxy resin is formed in spherical cap shape. Then, blending phosphor powder in white light prepared by matching epoxy resin with light emitted from chip is coated and solidified on the said spherical cap shaped epoxy resin so as to form a fluorescent layer. Finally, using transparent resin carries out conventional encapsulation to form a light cover. The said blending is prepared from epoxy resin, phosphor powder and diffusion powder in weight ratio as 0.5 - 1.2 : 0.02 - 0.1 : 0.01 - 0. 03. Adding diffusion powder of affecting shape of light beam and light spot into the blending, the invention intensifies purity of white light. Adjusting the blending can adjust color temperature of white light.

Description

technical field [0001] The invention relates to a method for manufacturing a light-emitting diode, in particular to a method for manufacturing a white light-emitting diode. Background technique [0002] Published patent, the patent number is: 02100345.9 Application date: January 11, 2002, the title of the invention is: "High-brightness nitride white light-emitting diode and its preparation method", the patent discloses a preparation method of white light-emitting diode , using the nitride light-emitting diode chip as the excitation light source, welding the gold wire after mounting, and then coating and curing the transparent resin on the chip and the gold wire to form a spherical crown, matching the transparent resin and the light emitted by the chip into white light The phosphor mixture is coated and cured on the spherical transparent resin, and finally the transparent resin is used for conventional encapsulation. The preparation method of this white light diode can impro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 郭玉国胡建宏
Owner JIANGSU WENRUN OPTOELECTRONICS
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